Semiconductor
Samsung Unveils Next-Gen Exynos 2700 Chipset Promising Enhanced AI Performance to Boost Market Share
9:32
Intel 18A-P Attracts Apple’s Upcoming M Chips as EMIB Secures Google TPUv8e Amid Rising Customer Confidence
11:43
Amkor Lead Reveals Intel-Supported “Glass Substrates” Technology Set for Commercialization in Three Years
15:23
NVIDIA Uninterested in HBF Memory Technology Despite New 4TB Stacks Surpassing HBM, Google Begins Sampling This Year
9:57
Google Becomes Key Customer of Intel Foundry, Set to Utilize EMIB Advanced Packaging for Next-Generation TPU
8:02
TSMC Aims for 20% Increase in 3nm & 2nm Wafer Production by End of 2026 Amid Ongoing Supply Crunch
6:47
Samsung Introduces 4F Cell Structure, Breaking 10nm DRAM Barrier and Increasing Density by Up to 50%
12:22
Groq’s Inference Chips Outperform NVIDIA’s Blackwell by 5x on Cost Efficiency and Deliver Results Twice as Fast
17:05