Amkor and Intel’s Groundbreaking Glass Substrates: Commercialization Expected in Three Years
According to Amkor Technology, a prominent partner of Intel, the innovative packaging technology known as Glass Substrates is projected to be ready for commercialization within the next three years. This advancement represents a significant evolution in semiconductor packaging methods, originally inspired by the CoWoS (Chip-on-Wafer-on-Substrate) approach that Intel has spearheaded.
The complexity of modern chips is increasing due to the escalating demands for computing power and memory. As a result, advanced packaging has become crucial for foundry operations. TSMC currently stands out as the leading provider of advanced packaging solutions, notably through its CoWoS 2.5D technology. This technology facilitates the integration of high-bandwidth memory (HBM) chips with logic chips within a single package, a necessity as the number of HBM chips used continues to grow. Recently, OpenAI demonstrated its plans to utilize an EMIB-like solution to address existing limitations of CoWoS.
Leading semiconductor manufacturers, including TSMC, are enhancing chip capabilities with new CoWoS solutions aimed for deployment by 2029. These upcoming designs feature a reticle size greater than 14 and promise to support up to 24 HBM packages. Furthermore, more sophisticated options like SoW-X are anticipated to offer over 40 reticles and support more than 60 HBM packages. The potential of these advancements to dramatically boost computing performance is evident, though they are not without challenges.
As the complexity of chip designs escalates, challenges related to cost, thermal and mechanical stress, and prolonged production times emerge. RDL (Re-Distributed Layer) processes can extend production times beyond a month, creating bottlenecks in performance, substrate quality, thermal management, and connectivity technologies. To mitigate these issues, Glass Substrates technology is emerging as a promising alternative.
During the recent Elec conference in Seoul, Korea, Yoo Dong-soo, Team Leader at Amkor Technology, highlighted the advantages of Glass Substrates over traditional organic options, particularly in terms of thermal stability and resistance to deformation.
“In the past, there were doubts about whether glass substrates could withstand the stress received during packaging, but technological stability is being secured, ”said Team Leader Yu.“We expect them to be commercialized within three years.”
Yoo Dong-soo – Team Leader of Amkor Technology via The Elec
Amkor’s established collaboration with Intel positions them as a frontrunner in the upcoming Glass Substrates initiative, drawing interest from major players in the semiconductor industry. Intel has already unveiled its initial Glass Core substrates, which utilize advanced EMIB packaging technology intended for next-generation AI applications.
The Glass Substrates project, initially launched under former Intel CEO Pat Gelsinger, faced uncertainty regarding its future. However, current Intel CEO Lip-Bu Tan has demonstrated a commitment to advancing this initiative.
Within the broader context of technological advancements, a three-year wait for the implementation of Glass Substrates seems relatively short. If this technology delivers on its promises, Intel’s foundry business could emerge as a dominant force in the rapidly evolving AI chip-making landscape.
News Source: The Elec
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