Google Becomes Key Customer of Intel Foundry, Set to Utilize EMIB Advanced Packaging for Next-Generation TPU

In a significant shift in the semiconductor landscape, Google’s upcoming TPUv8e AI chip is set to employ Intel Foundry’s innovative EMIB packaging technology. This development represents a notable achievement for Intel amidst the rising tide of interest in Agentic AI, which has propelled CPUs to the forefront, vying for attention alongside GPUs and memory solutions.

Intel Foundry to Produce Google’s Next-Gen TPU with EMIB Packaging

Recent reports from the Taiwanese publication Commercial Times indicate that Google will integrate Intel’s advanced EMIB technology in the fabrication of its next-generation TPU chip. This news comes as Intel makes strides in securing business from major companies, including Tesla, which has endorsed Intel’s 14A process technology for its TeraFab project—pivotal for its computing needs.

The supply chain points out that AI training chips, due to their advanced manufacturing processes and highly complex packaging, have significantly increased testing intensity.

Commercial Times

Google’s recent releases, the TPU8i and TPU8t chips, were crafted for inference and training tasks, utilizing TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) technology. This method has become a common choice for many chips driving AI operations worldwide.

Looking forward, the TPUv8e is expected to be produced leveraging Intel’s EMIB (Embedded Multi-Interconnect Bridge) technology. EMIB offers advantages over CoWoS by facilitating more adaptable, cost-effective, and scalable designs. Anticipated features include a primary compute die constructed by Google, while MediaTek will handle the I/O and backend designs.

A table titled 'Google TPU Chip Roadmap' outlines the timeline and design services of TPU 8i, TPU 8t, TPU v8e (TBD), and TPU v8p (TBD), with specific details on compute and I/O die process nodes, and advanced packaging from Broadcom, Google, and MediaTek. — Image Source: Commercial Times Taiwan

For the TPUv8p, Google is expected to rely entirely on Broadcom for its compute and I/O, while TSMC’s CoWoS and SoCI packaging technologies will support the manufacturing process. Although Intel’s involvement is still unofficial, the company has indicated it will refrain from confirming its customers until they make their own announcements.

Looking ahead, both the TPUv8e and TPUv8p are projected for a Q4 2027 release. We can anticipate official announcements by the end of this year or the beginning of next. This partnership with Intel is poised to bolster confidence in Intel Foundry, as its 14A technology and EMIB offerings represent an essential advancement, possibly easing the ongoing supply chain challenges that have surfaced amid the AI boom.

News Source: Dan Nystedt

Source & Images