TSMC Set to Commence Mass Production of 2nm Wafers at Two Facilities by Year-End, Projected to Drive Quarterly Sales to $30.1 Billion for Q3 and Q4

In Taiwan, TSMC’s cutting-edge semiconductor facilities located in Hsinchu and Kaohsiung are poised to become the leaders in 2nm wafer production. Recent industry analyses highlight that full-scale manufacturing of this advanced technology is anticipated to begin later this year. TSMC has already demonstrated remarkable progress, achieving a yield rate of 60 percent during initial trial runs. With the successful launch of operations at both plants, the company could potentially produce up to 50, 000 wafers each month, with a maximum capacity reaching 80, 000 wafers. This promising scenario aligns with growing market demand for 2nm chips, surpassing that of the current 3nm offerings. In fact, projections indicate that TSMC could see sales soar to approximately $30.1 billion throughout the third and fourth quarters of 2025.

Accelerated Pilot Production and Economic Impact

Encouraging signs from TSMC’s pilot production at the Hsinchu plant have led to operations commencing a quarter ahead of schedule. Notably, industry analyst Ming-Chi Kuo has revealed that the yield rates have exceeded expectations, suggesting that the 2nm manufacturing process is not just viable but also prepared for ramp-up. Reports from Dan Nystedt indicate that both Hsinchu and Kaohsiung facilities are expected to handle increasing demand effectively, with each projected to generate NT$1 trillion, equating to approximately $30.1 billion in revenue for the last half of 2025.

A significant portion of this anticipated revenue is linked to Apple, which is reportedly gearing up for the A20 chip in preparation for the iPhone 18 launch targeted for the latter half of 2026. However, Qualcomm is also stepping up its game, with plans to release two System-on-Chips (SoCs) utilizing TSMC’s 2nm process, including the expected Snapdragon 8 Elite Gen 2.

As TSMC advances towards its goals, the only substantial competition it faces comes from Samsung. Recent reports indicate that Samsung has managed a 30 percent yield on its 2nm technology during trial runs for the Exynos 2600. Although TSMC may have been slower to adopt the new lithography technologies in the past, it has consistently maintained its position as a leader in wafer output.

For further insights, visit Economic News Daily and explore more details about TSMC’s operations.

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