Samsung Exynos 2700 SBS Architecture Expected to Outperform Snapdragon, Boost Memory Bandwidth by 30-40%

Samsung has made significant advancements with the introduction of an innovative heat sink in the Exynos 2600 chip, enhancing its thermal stability. However, the tech giant is poised to take another leap with the upcoming Exynos 2700 chip. This new iteration will utilize a cutting-edge side-by-side (SBS) architecture, coupled with an advanced heat sink design, to achieve a remarkable enhancement in memory bandwidth and overall performance.

Samsung’s Exynos 2700 Chip: SBS Architecture and Heat Sink Innovation

The Exynos 2700 chip is set to leverage Samsung’s next-generation SF2P process, which builds upon the 2nm Gate-All-Around (GAA) technology previously employed in the Exynos 2600. For context, the GAA technology features a 3D transistor design where the gate surrounds the channel—comprising vertically stacked nanosheets—on all sides. This setup enhances electrostatic control and reduces voltage requirements. As a result, the upcoming SF2P process is projected to deliver a 12% improvement in performance and a 25% decrease in energy consumption compared to earlier generations.

Nevertheless, the most significant transformation in the Exynos 2700 chip lies in its architectural layout. The Exynos 2600 employs a traditional sandwich design, with RAM stacked atop the system-on-chip (SoC) and a copper-based heat sink known as the Heat Path Block (HPB) positioned above the RAM. While this configuration offers decent thermal efficiency, it inadvertently traps heat between the SoC and RAM, potentially affecting performance.

In contrast, the Exynos 2700 will utilize Fan-out Wafer Level Packaging (FOWLP) technology, allowing the RAM to be placed next to the SoC at the wafer level. This integration presents several advantages. Primarily, shorter interconnects are anticipated to boost memory bandwidth by approximately 30% to 40%, while also enhancing power efficiency. Furthermore, the HPB heat sink will effectively cover both the SoC and RAM, significantly improving the chip’s thermal stability.

CPU Thermal throttling results Exynos 2600 is more stable than 8 elite gen 5 (both result groups are from Samsung one UI only) pic.twitter.com/QEwJz6S4aL

— S (@SPYGO19726) April 25, 2026

Currently, the Exynos 2600 chip has demonstrated superior thermal stability compared to Qualcomm’s Snapdragon 8 Elite Gen 5. With the forthcoming advancements in the Exynos 2700, Samsung is expected to reinforce this competitive edge even further, setting the stage for groundbreaking performance in mobile technology.

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