MediaTek Dimensity 9600 Chip Expected to Thrive in Chinese Flagship Smartphones

Assessing Rumors: Our Rating System

0-20%: Unlikely – Lacks credible sources 21-40%: Questionable – Some concerns remain 41-60%: Plausible – Reasonable evidence available 61-80%: Probable – Strong evidence exists 81-100%: Highly Likely – Supported by multiple reliable sources

Rumor Assessment Result 60% – Plausible

Source Reliability: 3/5 Corroboration Evidence: 3/5 Technical Feasibility: 3/5 Timeline Viability: 3/5

The Impending Arrival of MediaTek’s Dimensity 9600 SoC

While MediaTek has not officially revealed its next-generation Dimensity 9600 mobile SoC, the increasing discontent with Qualcomm’s premium pricing strategy for its Snapdragon 8 Elite Gen 6 Pro and Snapdragon 8 Elite Gen 6 chips is prompting several smartphone manufacturers, especially in Asia, to consider the Dimensity 9600 as a competitive alternative.

Oppo and Vivo are Expected to Favor MediaTek’s Dimensity 9600 Over Qualcomm’s Offerings

A Weibo post by 'Digital Chat Station' mentions upcoming devices using 'OV Next Generation' and 'Pro Max'. — Source

Insights from the well-known Weibo tipster, Digital Chat Station, indicate that the upcoming flagship devices from Oppo and Vivo, particularly the Pro Max versions, are likely to be powered by the MediaTek Dimensity 9600 chip rather than Qualcomm’s Snapdragon 8 Elite Gen 6 Pro.

“Ahem, if OV’s next-generation Pro Max is confirmed, it will most likely be powered by the TSMC Dimensity 9600 series N2p chip. The SM8975-Snapdragon 8 Elite Gen6 Pro is only a high-end imaging flagship [not simple] (speculation).”[Translated via Google]

Recent analyses have highlighted that Qualcomm’s Snapdragon 8 Elite Gen 6 Pro chip promises exclusive features such as an enhanced GPU and support for LPDDR6 RAM and UFS 5.0 storage—yet, these advancements come with a steep price point that may deter some customers. In contrast, the Digital Chat Station suggests that manufacturers like Oppo and Vivo may gravitate toward the Dimensity 9600 for their premium devices.

For context, the Dimensity 9600 is anticipated to utilize TSMC’s N2P lithography process, which is designed to enhance performance by approximately 5% relative to the more traditional N2 process, a technology Apple is adopting for its upcoming A20 and A20 Pro chips.

This performance boost is critical as the Dimensity 9600 will need every advantage it can muster to compete against Apple’s new A20-series architecture, which is optimized to deliver a remarkable 29% performance increase without amplifying power consumption compared to the A18-series models.

Additionally, the Dimensity 9600 is likely to support LPDDR6 RAM, surpassing the LPDDR5 12GB RAM configuration expected in the iPhone 18 Pro and Pro Max. This could provide a theoretical edge in memory bandwidth, setting the stage for a competitive showdown, particularly with the Snapdragon 8 Elite Gen 6 Pro, which will also feature LPDDR6 support, leaving its non-Pro counterpart potentially sticking with LPDDR5.

Source & Images