Xiaomi CEO Unveils XRING 01: The Brand’s First In-House Chipset in Years, Launch Date Announced but Specs Remain Unrevealed

Xiaomi has officially unveiled its custom system-on-chip (SoC) known as the XRING 01, building anticipation following the initial announcement of its name about a month ago. During a recent update on a microblogging platform, CEO Lei Jun disclosed the launch, although key information regarding the specifications remains scarce. Fortunately, we have previously discussed the details related to this new chipset, and we will highlight the essential aspects to inform you about the technology that is set to power future Xiaomi smartphones.

Xiaomi’s XRING 01: Manufacturing Process and Future Developments

While initial reports indicate that the XRING 01 will be fabricated using TSMC’s 4nm technology, there are rumors suggesting that a more advanced 3nm variant could be in the works for future production. Interestingly, the announcement made by the Xiaomi CEO did not reveal much else; he teased the chipset’s public showing later this month but left many details unaddressed. The reasons behind this partial disclosure remain unclear—whether it’s a strategy to maintain suspense or a different rationale altogether.

Previously, we noted that the XRING 01 would utilize TSMC’s older 4nm process, unlike Qualcomm’s Snapdragon 8 Elite, which utilizes cutting-edge designs. Instead, Xiaomi’s in-house solution will incorporate ARM’s latest CPU architectures, featuring the notable Cortex-X925, capable of clocking speeds up to 3.20GHz.

By opting for a slightly older manufacturing technology, Xiaomi might aim to keep production costs manageable. However, it’s worth mentioning that the company reportedly achieved tape-out of a 3nm chipset last year, hinting that a launch could materialize as soon as 2025. This cautious approach may also stem from a desire to evade scrutiny from U. S.regulators, as the brand seeks to differentiate itself from the troubled path of Huawei.

To bolster the development of the XRING 01, Xiaomi has reportedly allocated a team of 1, 000 engineers, led by a former high-ranking Qualcomm director. This significant investment reflects Xiaomi’s ambitious vision for this new chipset, suggesting they are determined to establish a strong competitive foothold in the semiconductor landscape. Enthusiasts eagerly anticipate more information as the official launch date approaches later this month.

For regular updates, check the original announcement from Lei Jun.

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