As 2025 comes to an end, Taiwan Semiconductor Manufacturing Company (TSMC) is gearing up to initiate production of its groundbreaking 2nm chips. A wide array of clients eagerly anticipate the release of chip designs manufactured using this cutting-edge lithography technology. The demand for these wafers is so high that TSMC’s two production facilities are fully booked for all of 2026, with expectations to produce an impressive 100, 000 units per month.
Current Production Status of 2nm Wafers
Currently, TSMC is in the pilot production stage at its two 2nm fabrication plants located in Hsinchu and Kaohsiung. Reports from Dan Nystedt indicate that full-scale production has not yet started, although the yield rate for the pilot run has reached an estimated 70%.This figure raises some eyebrows since TSMC’s trial production run from the previous year achieved a similar yield rate.
Industry analyst Ming-Chi Kuo has suggested that TSMC’s yields for the 2nm process could surpass those achieved in trial runs. However, the latest reports keep the yield steady at 70%.Additionally, while there are no insights yet about the projected 100, 000 monthly output expected by mid-2026, it’s noteworthy that TSMC’s advanced packaging capacity has also been fully secured, capable of reaching 150, 000 wafers monthly next year.
TSMC is in the pilot production and validation phase of its 2nm process in two Taiwan locations, Fab 20 in Hsinchu (BaoShan) and Fab 22 in Kaohsiung, media report, with the yield rate nearly at 70%.Mass production is expected by year-end, with output increasing by mid-2026.…
— Dan Nystedt (@dnystedt) October 13, 2025
The report does not specify which TSMC client has secured the largest share of initial 2nm production. However, it is known that Apple has successfully locked in more than 50% of this capacity to maintain a competitive edge against rivals like Qualcomm and MediaTek. The first series of TSMC’s advanced lithography technology is designated as N2, which will soon be followed by an improved version known as N2P.
While the price tag for each wafer stands at approximately $30, 000, customers of TSMC may soon find that this investment pays off. In fact, reports suggest that the prices for TSMC’s existing 3nm technologies, such as ‘N3E’ and ‘N3P’, are expected to rise to $25, 000 and $27, 000, respectively.
For further details, see the report from United Daily News.
Images and additional insights can be found at Wccftech.
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