TSMC to Start 1.4nm Wafer Production in 2028, Promising Up to 30% Performance and Efficiency Gains with Advanced Lithography

The race for the 2nm semiconductor technology is currently dominated by TSMC, which recently commenced accepting orders for its state-of-the-art wafers. Apple is anticipated to be the first to leverage this groundbreaking technology. Although TSMC will require several years to fully transition to this advanced node, projections indicate that 1.4nm chips could emerge by 2028, based on the company’s announcements. This shift in manufacturing processes promises substantial advantages; let’s explore these developments in detail.

Introducing the 1.4nm A14 Node: A Leap into Sub-2nm Manufacturing

During the North America Technology Symposium in Santa Clara, California, TSMC’s CEO, C. C.Wei, unveiled the new manufacturing process designated for creating 1.4nm chips, known as the A14 or 14-Angstrom node. This innovative approach is tailored specifically for sub-2nm technology, catering to the demands of clients seeking to remain at the forefront of the semiconductor landscape. In the competitive realm of semiconductor fabrication, TSMC’s primary competitor is Samsung; however, reports suggest Samsung has postponed its own 1.4nm plans for reasons that remain unspecified.

On a positive note, Samsung has established a dedicated team aimed at accelerating the development of 1nm chips, with a mass production target anticipated for 2029. Should Samsung adhere to its timeline, it could create competitive pressure on TSMC, potentially leading to more favorable pricing for these advanced technologies. For now, though, it seems that TSMC’s immediate focus is optimizing yields for 2nm chips. Early reports from Nikkei Asia indicate that the A14 node could enhance performance by 15% while simultaneously reducing power consumption by 30%, marking a significant achievement for semiconductor efficiency.

While the identity of the first customer to place an order for the 1.4nm chips has not yet been disclosed, speculation leans heavily towards Apple. Given their longstanding partnership with TSMC and Apple’s demand for substantial wafer supplies, it is likely that securing this deal is a top priority for both entities. In addition to rolling out the A14 technology in 2028, TSMC has plans to implement next-generation packaging solutions that will integrate multiple chips with varied functionalities into a single package, with production slated to commence in 2027.

For further information, refer to the original article published by Nikkei.

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