TSMC to Begin 2nm Wafer Orders on April 1; Aims for 50,000 Monthly Production Output by Year-End

TSMC’s advancements in 2nm semiconductor technology have gained substantial attention within the industry. The Taiwanese semiconductor leader has reportedly achieved an impressive 60% yield in its next-generation manufacturing process. Recent reports indicate that TSMC is preparing to enter full-scale production, with order acceptance for its 2nm node set to begin on April 1. The demand for these wafers is anticipated to surpass that of the 3nm wafers, suggesting a robust interest from numerous customers eager to place orders for this cutting-edge technology.

Apple Poised to Be First in Line for TSMC’s 2nm Wafers

Among the prominent companies looking to secure TSMC’s 2nm wafers, Apple is expected to be the first customer, as it gears up to launch its A20 chip for the iPhone 18 series anticipated later in 2026. The production of 2nm wafers is centered around two key facilities in Kaohsiung and Baoshan. A production expansion ceremony is scheduled for March 31 in Kaohsiung, with the first batch of wafers arriving at Baoshan in Hsinchu by late April. Starting April 1, customers can officially make reservations for this groundbreaking technology, hinting at significant interest from Apple and other industry leaders.

Apple’s A20 chip will be specifically designed for the upcoming iPhone 18 lineup, underscoring the strategic significance of TSMC’s manufacturing capabilities. In addition to Apple, other major players such as AMD, Intel, Broadcom, and AWS are also expected to join the queue for TSMC’s 2nm node. TSMC has set an ambitious target of producing 50, 000 wafers per month by the end of 2025, with the potential to increase this output to 80, 000 units if both manufacturing plants operate at full capacity.

However, according to industry estimates, each wafer may carry a hefty price tag of around $30, 000. To alleviate some of the costs for clients, TSMC plans to introduce a ‘CyberShuttle’ service in April. This innovative approach allows customers to test their chips on the same wafer, effectively reducing unnecessary expenses and streamlining the evaluation process.

With TSMC’s bold aspirations, the first products utilizing 2nm technology are expected to debut in 2026, providing a glimpse into the significant performance and efficiency enhancements delivered by Apple’s A20 and additional products. Stay tuned for further updates as this technology landscape evolves.

News Source: China Times

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