TSMC Chooses Photomask Pellicles Over Costly High-NA EUV Machines for 1nm and 1.4nm Advanced Technologies

The transition to a 2nm manufacturing process at TSMC has been facilitated by the existing extreme ultraviolet (EUV) lithography machinery, enabling high-yield wafer production. However, as the company eyes further advancements into sub-2nm nodes—specifically the 1.4nm (A14) and 1nm (A10) technologies—TSMC faces significant engineering challenges. While the acquisition of ASML’s state-of-the-art High-NA EUV equipment could resolve these issues, a recent report indicates that TSMC has opted to pursue photomask pellicles instead.

Cost-effective Photomask Pellicles: A Strategic Choice for TSMC

TSMC anticipates commencing full-scale production of 2nm wafers by late 2025, subsequently shifting to the 1.4nm node in 2028. The company has already invested approximately NT$1.5 trillion (around $49 billion) to accelerate this advanced manufacturing journey, including the procurement of 30 EUV machines at its Hsinchu facility.

Despite the potential advantages of ASML’s High-NA EUV machines—priced at $400 million each and designed to enhance the efficiency and reliability of fabricating 1.4nm and 1nm chips—TSMC appears reluctant to invest in them. According to industry analyses by Dan Nystedt and Commercial Times, TSMC believes the financial implications of acquiring these machines do not justify their purported benefits. Instead, the semiconductor giant is focusing on integrating photomask pellicles into its production processes to guard against contamination from dust and other particulate matter.

This approach, while economically favorable, introduces its own set of complications. Manufacturing with standard EUV technologies for the 1.4nm and 1nm parameters necessitates increased exposure times, leading to more frequent use of photomasks. Such extensive usage raises concerns about yield compromise. Consequently, the implementation of pellicles becomes critical to maintain cleanroom standards and ensure successful product fabrication.

TSMC seems confident in its strategy, viewing pellicles as a reasonable alternative to the hefty price tag associated with High-NA EUV machines. Another consideration is production capacity; ASML can manufacture only five to six High-NA EUV units annually. Given TSMC’s need for an additional 30 standard EUV machines to fulfill growing demands from clients, including major players like Apple, investing heavily in fewer High-NA units may not align with its long-term objectives.

In summary, TSMC’s decision to utilize photomask pellicles over investing in expensive High-NA EUV machinery reflects a calculated balance between cost, efficiency, and adaptability in the rapidly evolving semiconductor landscape.

News Source: Commercial Times

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