Semiconductor
Apple Remains TSMC’s Top Customer in 2024, Contributing 24% of Revenue, but HPC Orders May Shift Market Dynamics in 2025
9:14
TSMC Begins Construction of 1.4nm Facility in Taiwan by 2025, Won’t Utilize ASML’s High-NA EUV Technology for This Process
8:22
M5 Announcement Expected This Week: Chipset Fabrication on TSMC’s 3nm ‘N3E’ Process Instead of N3P
7:05
TSMC’s 2nm Manufacturing Capacity Fully Booked at Two Local Facilities for 2026, Aiming for 100,000 Monthly Wafer Production by Next Year
11:37
Dimensity 9500 Expected to Cost Over 50% Less Than Snapdragon 8 Elite Gen 5, Utilizing Identical 3nm N3P Technology
8:52
Snapdragon 8 Elite Gen 5 Unit Price Predictions: Will They Impact Your Next Android Flagship Purchase?
17:47
Rumored Release of First 2nm N2 Chipsets by Apple, Qualcomm, and MediaTek in 2026; Speculations on ‘N2P’ Launches for Next Year Dismissed
13:53
TSMC’s 2nm Technology Customers Can Relax; Wafers 10-20% Costlier Than 3nm, But With Important Conditions
8:37