Snapdragon X2 Elite Extreme Die Package Features SiP Memory Layout Like Apple’s Unified RAM Architecture, Promising High Bandwidth

Qualcomm’s recently unveiled Snapdragon X2 Elite Extreme chipset stands out distinctly from the two other iterations of the Snapdragon X2 Elite introduced earlier. This distinction is not only reflected in the technical specifications but is also evident in the die package, which reveals significant innovations in memory architecture. Specifically, the Snapdragon X2 Elite Extreme is equipped with System-in-Package (SiP) memory, enabling it to achieve exceptional bandwidth levels.

Enhanced Memory Bandwidth with SiP Technology

For those unfamiliar, SiP technology integrates various circuits and components into a single package, combining RAM, storage, and other essential elements. This compact design is particularly advantageous for space-constrained devices like laptops, as it not only saves internal space but also enhances efficiency and memory speed. By positioning RAM in close proximity to the chipset, communication between the two components is accelerated, ultimately boosting memory bandwidth.

The structural similarities between the Snapdragon X2 Elite Extreme’s SiP memory layout and Apple’s unified RAM architecture are noteworthy. Both architectures aim to optimize efficiency by allowing the CPU and GPU to access shared memory. However, it’s important to recognize that, despite this layout similarity, the core functionalities of the two architectures differ significantly.

Snapdragon X2 Elite Extreme die package — Image credits – @IanCutress

This innovative package design accounts for the impressive memory bandwidth of 228GB/s associated with the Snapdragon X2 Elite Extreme, which also supports a minimum of 48GB of memory. In contrast, the other Snapdragon X2 Elite models utilize off-package memory, resulting in a decreased bandwidth of 152GB/s. A recent observation made by @IanCutress confirms that Qualcomm has partnered with Samsung to source key components for this package, as evidenced by the ‘SEC’ label on the die.

Three WeUs as far as I can tell X2E-96-100 18 core, 48GB SiP mem 12 channel, 228 GB/sec 4.6 GHz CPU, 5G 2C 1.85GHz peak GPU X2E-88-100 18 core, off package mem 8ch, 152 GB/sec 4.0 GHz, 4.7G turbo 2C X2E-80-100 12-core, off package mem 8ch, 152 GB/sec 4.0 GHz, 4.7G 1C/4.4G 2C pic.twitter.com/s6g3JyEbvC

— 𝐷𝑟.𝐼𝑎𝑛 𝐶𝑢𝑡𝑟𝑒𝑠𝑠 (@IanCutress) September 24, 2025

The physical dimensions of the Snapdragon X2 Elite Extreme die suggest robust performance capabilities, an important factor for laptop manufacturers planning to integrate this chipset into devices set to launch in early 2026. Adequate cooling solutions will be crucial to allow the chipset to operate at its full potential and deliver optimal performance.

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