SiCarrier: China-Based Company Tied to Huawei Developing Machines to Replace ASML’s Equipment for Advanced Wafer Production

China’s reliance on antiquated Deep Ultraviolet (DUV) technology, particularly utilized by its largest semiconductor manufacturer, SMIC, places the nation at a strategic disadvantage against the United States, which leverages cutting-edge Extreme Ultraviolet (EUV) technology from ASML. In the context of an ongoing export ban, China’s access to advanced chip-making equipment is severely restricted. Consequently, the only viable path for China to maintain competitiveness in the semiconductor sector is to innovate and develop domestic chip fabrication tools.

SiCarrier: Pioneering Domestic Semiconductor Machinery with State Support

Recent reports indicate that SiCarrier, a company with strong ties to Huawei, is actively engaged in creating independent EUV solutions to reduce reliance on foreign sources like ASML. This initiative is bolstered by substantial support from the Chinese government, enabling SiCarrier to accelerate its operations and technologies.

According to a previous report, prototypes of custom-built EUV machinery utilizing laser-induced discharge plasma (LDP) technology are anticipated to begin trial production by the third quarter of 2025. While it’s unclear whether these prototypes correspond to those under development by SiCarrier, the company is reportedly focused on a diverse array of machines aimed at diminishing the influence of foreign competitors and enhancing China’s self-sufficiency in semiconductor manufacturing.

SiCarrier’s efforts are further reinforced by backing from the Shenzhen government, which is pivotal in facilitating the company’s capacity to innovate. The current focus of development encompasses various segments of chip fabrication, benchmarking against industry titans such as ASML, Applied Materials, and Lam Research. Additionally, the company is advancing technologies in lithography, chemical vapor deposition, measurement, physical vapor deposition, etching, and atomic layer deposition—all areas typically dominated by firms from the Netherlands, the U. S., and Japan.

Despite these advancements, the implementation timeline for SiCarrier’s first prototypes remains unspecified. Currently, SMIC has only achieved a 5nm manufacturing process, marking its most sophisticated lithography technology to date. However, large-scale mass production has not yet been realized, primarily due to the constraints of the existing DUV equipment, which is time-consuming and produces a significant number of defective wafers, thereby inflating overall costs.

With the collaborative efforts of SiCarrier, Huawei, and the Chinese government, there is cautious optimism that China may soon overcome existing hurdles in chip manufacturing technology.

For further details, refer to the news source: Nikkei Asia.

Source & Images