Samsung Exynos 2500 Launch: First 3nm GAA Chipset with 10-Core CPU, Enhanced NPU, and Advanced FOWLP Packaging

Samsung’s ambitions in advanced semiconductor technology have led to the introduction of the Exynos 2500, a flagship chipset slated to power the forthcoming Galaxy Z Flip 7. This development comes despite the challenges Samsung has faced with its 3nm Gate All Around (GAA) fabrication process. The Exynos 2500 mirrors several features from its predecessor, the Exynos 2400, including a sophisticated 10-core CPU architecture and enhancements through Fan-Out Wafer-Level Packaging (FOWLP).Below, we delve into the key features and specifications of this promising SoC.

Exynos 2500: Mass Production Yet Limited Availability

Listed as ‘Mass production’ on the specifications page, the Exynos 2500 faces hurdles due to lower-than-expected yield rates, suggesting a more restricted release of the chipset. This might impact its availability in the market as Samsung navigates production challenges.

Powerful Yet Mixed CPU Configuration

In an intriguing twist, Samsung has equipped the Exynos 2500 with a Cortex-X5 core, officially known as the Cortex-X925, which operates at an impressive 3.30GHz. The CPU cluster is complemented by two Cortex-A725 cores rocking 2.74GHz, five additional Cortex-A725 cores at 2.36GHz, and two Cortex-A520 cores running at 1.80GHz. Expectations for this chipset’s performance against competitors like the Dimensity 9400, Snapdragon 8 Elite, and Apple’s A18 series may need tempering based on the latest benchmarks.

Performance Insights and Benchmark Expectations

Recent leaks from Geekbench 6 cast shadows on the Exynos 2500’s performance, revealing disappointing results in both single-core and multi-core metrics. Nevertheless, the final performance assessment will arrive with real-world testing on the Galaxy Z Flip 7, which we anticipate keenly. Alongside its extensive 10-core setup, the chipset features the Xclipse 950 GPU, compatibility with LPDDR5X RAM, fleet UFS 4.0 storage, and a robust AI engine capable of reaching up to 59 trillion TOPS—39% more efficient than its predecessor, the Exynos 2400.

Enhanced Graphics and Thermal Management

Samsung asserts that the Exynos 2500’s big-core performance boasts a 15% improvement, augmented by ray tracing support via AMD’s RDNA3 architecture. This advancement signals a leap towards console-like graphics for mobile devices. Additionally, the efficiency of the Exynos 2500 benefits significantly from the latest FOWLP technology, promoting better heat dissipation and power management. While it remains uncertain if the Galaxy Z Flip 7 will feature a vapor chamber, its inclusion could further enhance cooling performance alongside the Exynos 2500’s improvements.

“Increase your productivity while using less power. The Exynos 2500 brings you enhanced power efficiency enabled by improvements in the power reduction architecture across various blocks, as well as the latest manufacturing processes and packaging technology. Built with the cutting-edge 3nm Gate All Around (GAA) process technology, the Exynos 2500 provides better power efficiency and enhanced heat dissipation at a much reduced chip thickness through fan-out wafer-level packaging (FOWLP).Plus, further optimization has been achieved through the aforementioned modifications to CPU core structure and implementation of an analog GNSS interface.”

Impressive Camera and Connectivity Features

The Exynos 2500 also presents robust multimedia capabilities, featuring a primary camera that supports a staggering 320MP resolution and allows for 8K video recording at 30FPS. On the connectivity front, this chipset shines with support for Bluetooth 5.4, Wi-Fi 7, and a high-speed 5G modem capable of downlink speeds reaching 9.6Gbps for FR1 and 12.1Gbps for FR2. As we look forward to Samsung’s Galaxy Unpacked event next month, more insights into the Exynos 2500 are anticipated, so make sure to stay updated for the latest revelations.

News Source: Samsung

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