Qualcomm and MediaTek Target Competitive Edge Over Apple by Transitioning to TSMC’s Enhanced 2nm N2P Technology, Mass Production Set to Begin in H2 2026

Evaluating Rumors

0-20%: Unlikely – Insufficient credible sources 21-40%: Questionable – Several reservations remain 41-60%: Plausible – Reasonable amount of evidence 61-80%: Probable – Robust backing 81-100%: Highly Likely – Numerous trustworthy sources

Rumor Assessment Score: 55%

Source Quality: 3/5 Corroboration: 3/5 Technical Feasibility: 3/5 Timeline Reliability: 2/5

Qualcomm and MediaTek are gearing up to unveil their next-generation chipsets, the Snapdragon 8 Elite Gen 6 and Dimensity 9600, respectively. Both companies are expected to utilize TSMC’s cutting-edge 2nm process for the first time. Notably, TSMC has developed two iterations of this advanced lithography: the original N2 and the enhanced N2P. While Apple is anticipated to launch its A20 and A20 Pro using the first version, reports suggest that both Qualcomm and MediaTek may take the lead by adopting the N2P node.

Concerns Over TSMC’s 2nm Process Capacity

Analyst forecasts indicate that TSMC’s 2nm manufacturing capabilities will be limited, estimating a monthly output between 15, 000 and 20, 000 wafers. Prior rumors had hinted at Qualcomm pursuing the N2P process for the Snapdragon 8 Elite Gen 6. Recent developments assert that MediaTek will follow suit, preparing to launch its Dimensity 9600 with this advanced lithography. The Taiwanese company has proudly announced completing the tape-out for its inaugural 2nm chipset, with a debut expected in late 2026.

Despite a tipster dismissing these claims, insisting Apple, Qualcomm, and MediaTek will utilize the N2 node, evidence increasingly favors Android chipset manufacturers leaning towards the improved N2P variant. This strategic pivot could stem from the desire of competitors to outperform Apple in the lithography arena, especially considering Apple’s A19 Pro boasts superior ‘performance per watt’ metrics in Geekbench 6, surpassing both Qualcomm’s Snapdragon 8 Elite Gen 5 and MediaTek’s Dimensity 9500. Thus, merely sharing the same manufacturing process may not suffice for Qualcomm and MediaTek to gain competitive advantages.

Apple’s Edge in Chip Development

Apple’s lead in chip design is predominantly attributed to its years of experience and a team of skilled engineers dedicated to creating custom CPU and GPU cores that often outperform competitors. The efficiency cores in the A19 Pro delivered an impressive performance improvement of up to 29 percent, all while maintaining power consumption. In contrast, Qualcomm’s shift towards in-house core development is still in its infancy, with the Snapdragon 8 Elite Gen 5 being just its second SoC utilizing these capabilities.

The Dimensity 9500 currently relies on ARM’s architecture, which, while cost-effective, hampers its performance and efficiency compared to Apple’s offerings. One reason Qualcomm and MediaTek are turning to TSMC’s N2P wafers, expected to enter mass production in late 2026, is the possibility that Apple has already secured a majority of the initial supply of 2nm wafers, leaving less for its competitors.

While it’s essential to stay cautious about these developments, as they rely significantly on rumor, reports indicate that TSMC’s 2nm process will be a coveted resource in the coming year. Analysts predict that output could peak at 20, 000 wafers monthly by the end of 2025. We advise readers to approach this information with a critical eye, and we will continue to monitor the situation closely for further updates.

News Source: Commercial Times

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