MediaTek to Begin 2nm Chipset Tape-Out in Q4 2025 to Gain Competitive Edge

MediaTek has set its sights on becoming a global leader in chipset technology, with its eyes firmly on the future of chip manufacturing. The company’s highly anticipated 2nm chips are projected to debut sometime next year. However, for its Dimensity 9500 model, set to launch later this year, MediaTek is opting to utilize Taiwan Semiconductor Manufacturing Company’s (TSMC) third-generation 3nm process.

In a move that underscores its ambition, MediaTek plans to begin the tape-out process for its cutting-edge 2nm silicon in the last quarter of 2025. This advancement is noteworthy as it highlights MediaTek’s commitment to innovation, aiming to introduce its first 2nm product by late 2026. The early tape-out process is expected to allow ample time for refinements, ensuring that MediaTek can efficiently produce a sufficient quantity of chips to meet market demands.

Efficiency Boost: MediaTek’s Dimensity 9600 Comparison

A recent comparison indicates that the forthcoming Dimensity 9600 could offer an impressive 25% enhancement in efficiency over its predecessors. The tape-out for these advanced 2nm chips is scheduled to begin in September 2025. For those unfamiliar, tape-out marks the conclusion of the design phase of a silicon chip and initiates its transition to mass production at TSMC, a process that entails substantial financial investment, often running into millions.

Following this announcement, a MediaTek executive confirmed that the tape-out would launch in September. TSMC, already positioned to take orders for its next-generation lithography from April 1, presents MediaTek with a strategic advantage. The timing allows for necessary modifications, enabling MediaTek’s upcoming chip to rival the performance and efficiency levels of Qualcomm’s Snapdragon 8 Elite Gen 2.

The anticipated 2nm System on Chip (SoC) is expected to deliver up to 15% improved performance and a remarkable 25% reduction in power consumption when compared to the N3 node. However, it remains unclear whether this comparison pertains to the second-generation N3E or the third-generation N3P processes. Concurrently, Qualcomm is gearing up for its Snapdragon Summit 2025, scheduled for September 23, where we anticipate a full introduction of the Snapdragon 8 Elite Gen 2, which is positioned to compete with MediaTek’s upcoming Dimensity 9500.

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