M5 Pro Missing in Latest iOS 26.3 Beta: Rebranded M5 Max with Single Chip Design via TSMC’s 2.5D Technology

Apple’s anticipated M5 Pro and M5 Max chip releases are currently shrouded in uncertainty, with the most reliable information pointing to a launch sometime in the first half of 2026. Recent findings from the iOS 26.3 Beta revealed references to only the M5 Max and M5 Ultra chipsets, leaving the M5 Pro conspicuously absent.

This absence has sparked speculation that Apple may introduce the M5 Pro later in the development cycle. Notably, a YouTuber made an intriguing observation: the so-called ‘middle of the pack’ system-on-chip (SoC) may simply be a rebranded version of the M5 Max, sharing the same underlying architecture. Both chipsets are expected to employ TSMC’s advanced 2.5D design technology, diverging from the previously utilized Integrated Fan-Out (InFO) technique.

Cost Savings Through Unified Chip Design for M5 Pro and M5 Max; Future of M5 Ultra Still Unclear

Vadim Yuryev, the host of the Max Tech YouTube channel, has provided insights regarding the recent leak of the M5 line. He highlighted the financial burden associated with designing distinct chip dies, a process that involves substantial costs for development, tape-outs, and mass production runs. According to Yuryev, Apple’s strategy to utilize a single die design for the M5 Pro and M5 Max could result in significant cost savings.

Yuryev posits that both chip models will feature a novel architecture with separate CPU and GPU blocks. This design will enable users to customize their configurations based on specific workload requirements. With the implementation of TSMC’s 2.5D packaging technology, Apple could simply deactivate certain performance and GPU cores for the M5 Pro, while activating them for the M5 Max model, allowing for efficient rebranding.

HOLY SMOKES! Just figured out why Apple’s M5 Pro chip did NOT show up in the recent beta code leak: Apple is using new 2.5D chip tech, allowing them to use a SINGLE M5 Max chip design for BOTH the M5 Pro and M5 Max models. This saves Apple LOTS of money on WeUs + Design1/3👇 pic.twitter.com/6oOmEGI0uR

— Vadim Yuryev (@VadimYuryev) February 6, 2026

The unified chip design not only facilitates process efficiencies but also enhances thermal performance by reducing resistance and minimizing defective units. Given that the base M5 chipset can potentially reach temperatures of 99 degrees Celsius under heavy load, this new approach is undoubtedly a favorable change. It remains to be seen if Yuryev’s predictions about Apple’s chip strategy will hold true. We welcome your thoughts in the comments below!

Source: Vadim Yuryev

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