Everything You Need To Know About Apple’s A20 and A20 Pro: The First 2nm Chipsets in iPhone

Apple’s next-generation chipsets, the A20 and A20 Pro, are on the horizon as the company transitions from its successful A19 and A19 Pro, the last chipsets fabricated with TSMC’s advanced 3nm technology. Set to launch with the iPhone 18 series next year, these processors will utilize TSMC’s groundbreaking 2nm fabrication process for the first time, marking significant advancements in silicon technology.

Understanding TSMC’s 2nm Process

As TSMC initiates mass production of its 2nm wafers, reports indicate that its local facilities are already operating at full capacity. Apple has reportedly secured a dominant share of this capacity to outpace competitors like Qualcomm and MediaTek. The improvements associated with the 2nm process are substantial, prompting Apple’s early investment.

While detailed comparisons with TSMC’s latest 3nm ‘N3P’ process remain unavailable, it’s noteworthy that N3P is essentially an optical shrink of the earlier N3E variant, rendering the technical differences minimal. When contrasted with the N3E node, TSMC’s 2nm technology boasts capabilities such as:

10-15% enhanced performance without increased power consumption
25-30% reduction in power usage while maintaining the same performance level
Over a 15% increase in transistor density for equivalent power and performance

Despite speculation regarding Qualcomm’s potential advantage with its Snapdragon 8 Elite Gen 6 utilizing TSMC’s 2nm ‘N2P’ process, insiders have clarified that all SoCs, including those from Apple, will be employing the N2 node in the upcoming year. This technological progression promises improved performance per watt for the A20 and A20 Pro, allowing Apple to explore designs for slimmer models, such as the anticipated second-generation iPhone Air.

Codenames and Performance Specifications for A20 and A20 Pro

We now have insight into the codenames for Apple’s next-generation chipsets: the A20 is internally referred to as ‘Borneo, ’ while the robust A20 Pro carries the codename ‘Borneo Ultra.’ It’s anticipated that the standard iPhone 18 will integrate the A20 chip, with the more advanced iPhone 18 Pro, iPhone 18 Pro Max, and Apple’s inaugural foldable device featuring the A20 Pro.

In terms of core configuration, Apple is likely striving for a balanced performance and energy efficiency, leading us to believe that both the A20 and A20 Pro will consist of a 6-core CPU architecture, divided into two high-performance cores and four efficiency cores. The adoption of the 2nm process provides Apple with the opportunity to enhance both single-core and multi-core performance significantly, building upon the impressive efficiency gains seen with the A19 Pro’s architecture.

Anticipated Chip Variants for 2026

While detailed information on GPU core counts remains undisclosed, Apple has elevated its chip-binning strategy this year. For instance, the base iPhone 17 was equipped with the standard A19, whereas the iPhone Air utilized an A19 Pro equipped with a 5-core GPU, while the iPhone 17 Pro and Pro Max versions featured an upgraded 6-core GPU.

Looking ahead to 2026, three variants of the A20 and A20 Pro chipset are expected to be integrated across the iPhone 18 lineup. Below are speculated configurations:

iPhone 18 – A20 (2 performance cores, 4 efficiency cores, 5-core GPU)
iPhone Air 2 and iPhone 18 Pro – A20 Pro (2 performance cores, 4 efficiency cores, 5-core GPU)
iPhone 18 Pro Max – A20 Pro (2 performance cores, 4 efficiency cores, 6-core GPU)
Foldable iPhone – A20 Pro (2 performance cores, 4 efficiency cores, 6-core GPU)

Innovative Packaging Technologies for A20 and A20 Pro

Apple has long utilized integrated Fan-Out packaging (inFO) for its A-series processors. However, it appears that the company is poised to transition to Wafer-Level Multi-Chip Module Packaging (WMCM) for the A20 and A20 Pro. This new method enables the integration of multiple dies—such as CPU, GPU, and memory—at the wafer level before they are diced into individual chips.

This packaging innovation will allow Apple to produce smaller, more efficient system-on-chips (SoCs) cost-effectively. Given that TSMC estimates the cost of 2nm wafers at approximately $30, 000, Apple’s shift in packaging technology is essential for maintaining profitability while leveraging cutting-edge fabrication processes.

While specific pricing details for the A20 and A20 Pro remain undisclosed, it is anticipated that these advanced chipsets will come at a premium. Furthermore, the 2nm architecture is not exclusive to the iPhone lineup; Apple is also gearing up to implement the new M6 chip for its next generation of MacBook Pro models. In summary, 2026 is shaping up to be an exhilarating year for technological breakthroughs, and we are committed to delivering the latest updates to our readership.

Source & Images