Intel 18A-P Attracts Apple’s Upcoming M Chips as EMIB Secures Google TPUv8e Amid Rising Customer Confidence

Intel is experiencing a significant boost in confidence surrounding its advanced Foundry technologies, particularly its upcoming nodes such as 18A-P, 14A, and the innovative EMIB packaging solution.

Apple and Google Set to Utilize Intel’s Advanced Technologies: 18A-P and EMIB

The surge in Agentic AI and inferencing capabilities has intensified demand for high-performance CPUs. This spike has exacerbated supply constraints for major semiconductor firms like TSMC, which are now on extensive expansion efforts to keep pace with the burgeoning market needs. Simultaneously, Intel is strategically boosting its revenue through the sale of salvaged semiconductor dies while attracting interest from external customers eager to adopt its next-generation processes and packaging technologies.

Intel’s 14A technology has garnered attention from several prominent customers, and the EMIB solution is gaining traction by proving its advantages over TSMC’s CoWoS packaging approach.

According to supply chain insiders, some clients have initiated test chip verification for the 18A process. This includes the gradual completion of related processes, with the 18A-P process being deployed concurrently. As the process development kit (PDK) matures, the adoption rate among customers is on the rise. Notably, major companies such as Google and Apple are set to begin leveraging Intel’s foundry services for specific products in the upcoming year.

— China Times (Machine Translated)

While Intel has not publicly disclosed large foundry agreements aside from projects with Elon Musk’s TeraFab, which will utilize 14A technology, industry sources are divulging details about Intel’s internal progress.

According to China Times, multiple clients have reached the testing phase for chips using the 18A process technology, indicating a burgeoning trust in Intel’s offerings. This testing will facilitate a timely deployment readiness for Intel’s 18A-P technology, which represents an upgraded iteration of the 18A node. Concurrently, the 18A PDK is progressing towards maturity, with the 14A PDK anticipated to achieve version 0.9 by year-end.

A person in formal attire stands on stage with a large semiconductor wafer displayed behind them, along with the word 'Welcome' shown on a screen.

The 18A-P process node from Intel promises an impressive 8% enhancement in performance per watt, while maintaining the same density as its predecessor, the 18A node.

Currently, Apple is expected to leverage the 18A-P process for its forthcoming “M”series chips aimed at client applications. Additionally, Google is reportedly interested in utilizing the EMIB advanced packaging solution for its upcoming TPUv8e chip.

During a recent earnings call, Intel announced that high-volume manufacturing (HVM) for the 18A node has been achieved with the Panther Lake project. This is anticipated to significantly boost revenue as Panther Lake is poised to dominate the retail sector. Furthermore, Intel’s CEO, Lip-Bu Tan, is scheduled to deliver a keynote at Computex 2026, where further insights into the Foundry business strategy are expected to be unveiled.

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