China’s New Lithography Machine Achieves ASML’s High-NA EUV Precision, Yet Restricted to Research Use Not Mass Production

China’s advancements in chipmaking are garnering attention, particularly following the development of the nation’s first e-beam lithography tool intended for commercial use.

China’s Pioneering E-Beam Lithography Machine: A Step Forward with Limitations

In the realm of lithography, China has historically lagged behind the West, primarily due to restricted access to ASML’s state-of-the-art equipment, a critical obstacle in producing high-end semiconductor chips. Nevertheless, several Chinese companies are actively working to introduce extreme ultraviolet (EUV) technology into the market. One notable achievement comes from researchers at Zhejiang University, who have successfully designed a lithography machine that employs electron beams to carve out semiconductor wafers (via SCMP).

This newly developed device, known as Xizhi, is a significant milestone, even though it does not yet match the capabilities of ASML’s High-NA EUV systems. The e-beam lithography (EBL) tools are currently subject to controls under U. S.export regulations, making this achievement pivotal for China’s domestic chip industry. While the machine can achieve a precision of 0.6 nanometers, comparable to ASML’s advanced technology, its throughput is a major drawback. The point-by-point writing method employed by EBL means it can take hours to produce a single wafer, severely limiting its efficiency for mass production.

Samsung To Acquire Its First High-NA EUV Lithography Machinery By Next Quarter, Commercial Implementation Expected In Late 2025 1 — Image Credits: ASML

For the majority of its standard chip production, China continues to rely on deep ultraviolet (DUV) machines. The introduction of this EBL machine could potentially narrow the research and development gap between Chinese firms and their Western counterparts, allowing for the creation of advanced chip prototypes. However, the sustainability of this method for large-scale manufacturing remains questionable.

Despite being years behind the U. S.in semiconductor technologies, China’s progress is evident, with the gap gradually closing. The future implications of EBL on China’s ambition to ascend in the global chip market will be fascinating to observe.

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