The anticipated A20 and A20 Pro chipsets are poised to debut as Apple’s first 2nm processors in the upcoming iPhone 18 series. This advancement underscores Apple’s commitment to leveraging the latest in semiconductor technology through the expertise of TSMC. However, the transition to this cutting-edge lithography is not without significant financial implications; each 2nm wafer is projected to cost around $30, 000. Consequently, Apple joins a select group of companies eager to innovate within the realm of 2nm chip production. Analysts suggest that Apple may explore alternative packaging techniques to enhance the performance characteristics of its chipsets while also seeking cost reductions. Notably, the A20 may shift from InFO (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging by 2026.
WMCM Packaging: A New Direction for Apple’s A20 Chip
In a significant shift, Apple is moving away from traditional InFO packaging in favor of WMCM technology. This transition aligns with the insights provided by renowned analyst Ming-Chi Kuo from TF International Securities. Earlier this year, TSMC unveiled its CyberShuttle service to minimize chip production costs by allowing partners to utilize the same test wafers. Despite these developments, Apple appears to be investigating its own innovative solutions. According to reports, the WMCM packaging will incorporate Molding Underfill (MUF), a method that merges underfill and molding processes seamlessly.
This advanced technique not only enhances material efficiency but also boosts yield rates and overall manufacturing efficiency. Although TSMC’s yields during its initial 2nm production trial were about 60 percent, the actual figures may vary significantly as production ramps up to 60, 000 wafers monthly. Without exclusive leniency on defective wafers from TSMC, Apple is likely exploring various strategies to mitigate costs associated with its chipsets.
Furthermore, Apple is expected to adopt SoIC (System on Integrated Chips) technology, which involves stacking two advanced chips vertically. This approach facilitates ultra-compact connections between the chips, leading to reductions in latency and improvements in performance and efficiency. However, it’s reported that this advanced stacking technology may be limited to Apple’s M5 series chipsets, which are intended for the refreshed 14-inch and 16-inch MacBook Pro models.
For Further Insights: Visit the original source of the information presented by Ming-Chi Kuo.
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