As TSMC gears up for the production of 2nm wafers in the last quarter of this year, Apple has strategically secured nearly 50% of the initial manufacturing capacity. This move is particularly noteworthy as the technology giant plans to utilize this capacity for its upcoming A20 and A20 Pro chipsets intended for the iPhone 18 series set to launch in 2026. Recent developments suggest that Apple is also in the process of preparing four System-on-Chip (SoC) designs to be mass produced with this cutting-edge lithography technology. Additionally, these chips will feature a new packaging format that promises to enhance performance compared to existing solutions.
Anticipated Advancements: A20, A20 Pro, New MacBook Pro, and Apple Vision Pro with 2nm Silicon
In the competitive landscape of chip development, Apple is not alone, as Qualcomm and MediaTek are also preparing to unveil their first 2nm chipsets in 2026. However, Apple is positioned to have a significant advantage by deploying this advanced technology across a broad spectrum of its devices. According to reports from China Times, the A20 and A20 Pro are set to utilize a substantial portion of TSMC’s early 2nm capacity. Moreover, Apple is expected to implement the innovative Wafer-Level Multi-Chip Module (WMCM) packaging for these new designs.
The WMCM technology enables manufacturers like Apple to consolidate various components, such as CPUs, GPUs, and DRAM, into a compact package. This integration not only enhances performance but also improves thermal efficiency and extends battery life. Taking cues from the previous A19 and A19 Pro models, it is anticipated that Apple will introduce three variants of the A20, with the Pro version likely undergoing selective binning to optimize performance.
Beyond smartphones, the upcoming MacBook Pro lineup is rumored to incorporate the M6 chip, with speculation suggesting a transition from mini-LED to OLED display technology, marking a significant upgrade. Additionally, while a successor to the Apple Vision Pro is expected in 2026, it will feature an R2 co-processor also developed using TSMC’s 2nm process.
While details about the specific SoC for the Vision Pro’s internals are currently under wraps, further information is anticipated in the near future. TSMC’s 2nm technology is evidently in high demand, with projections indicating the company could produce around 100, 000 wafers each month by the end of 2026 to meet growing needs. However, this premium manufacturing process comes at a cost of approximately $30, 000 per wafer, presenting a significant financial commitment for its industry partners.
News Source: China Times
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