Apple May Bypass TSMC’s Advanced ‘SoIC-MH’ Packaging for M5, Reports Indicate Technology Could Be Used for M5 Pro and Higher Performance SoCs

TSMC has recently implemented advanced packaging technologies that aim to enhance the performance characteristics of chipsets produced using its pioneering 3nm process technologies. This innovative approach includes the Small Outline Integrated Circuit Molding-Horizontal packaging, commonly referred to as SoIC-MH. This new packaging design is targeted at improving both thermal and electrical performance, ultimately resulting in superior performance-per-watt metrics for System on Chips (SoCs).However, recent reports suggest that while Apple has commenced mass production of its new M5 chipset, the SoIC-MH technology might be reserved for the anticipated M5 Pro version.

Why Apple May Transition to SoIC-MH for the M5 Pro

The distinction between the M5 and M5 Pro chipsets isn’t precisely outlined, sparking speculation regarding their design differences. Reports from ETNews indicate a lack of evidence that the mainstream Apple Silicon will utilize the same advanced packaging technology as its higher-end counterpart. A primary reason for this divergence lies likely in cost considerations. Moreover, TSMC’s 3nm N3E and N3P technologies only provide a modest efficiency enhancement—between 5% and 10%—which may limit innovation opportunities for Apple.

Given this situation, Apple might choose to keep the CPU and GPU core count of the M5 Pro consistent with its predecessor to focus solely on enhancing clock speeds. This strategic move, while potentially beneficial in the short term, could lead to minimal differences in performance between the M5 Pro and the current M4 Pro, potentially resulting in weak sales for devices featuring this chipset.

On the other hand, adopting TSMC’s SoIC-MH for the M5 Pro could significantly enhance its capabilities. The SoIC-MH technology utilizes vertically stacked chips, which allow for increased circuit layers and can subsequently boost performance. This could position the M5 Pro as a formidable contender in the market.

There are also prospects for the M5 Max and M5 Ultra series to leverage the SoIC-MH technology, although reports have not explicitly confirmed this possibility. As exciting as these developments are, it’s essential to approach this information judiciously until further verification is provided. We will continue to monitor the situation and deliver updates as they arise.

News Source: ETNews

Source & Images