Apple A20 Chip Exclusively for iPhone 18 Pro, iPhone 18 Pro Max, and Foldable Flagship: Utilizing TSMC’s Advanced 2nm Process and New WMCM Packaging

TSMC has reportedly commenced accepting orders for its groundbreaking 2nm wafers, with the first chipsets set to debut in late 2024. Among the expected early adopters is Apple, which is likely to leverage this advanced lithography for the production of its A20 chip. This next-generation chipset is rumored to be manufactured using TSMC’s innovative Wafer-Level Multi-Chip Module (WMCM) packaging technique. However, the advantages of this technology will be primarily accessible to users of specific upcoming models: the iPhone 18 Pro, iPhone 18 Pro Max, and Apple’s highly anticipated foldable flagship device.

Potential Impact of WMCM Packaging on Apple’s A20 Chip

The integration of WMCM packaging is set to provide Apple with significant advantages. This advanced manufacturing method enables the combination of multiple chip components, such as CPUs, GPUs, and memory, at a wafer level. Consequently, Apple can produce smaller, more power-efficient chips without sacrificing performance. The expected outcome is an impressive ‘performance per watt’ ratio, boosting the overall efficiency and capabilities of the iPhone’s architecture.

iPhone 18 Series Rumors and Specifications

According to a report from China Times, the A20 chipset will be featured in the iPhone 18 Pro series and their foldable counterpart, tentatively called the iPhone 18 Fold. The dedicated production line for WMCM chipsets at TSMC’s Chiayi AP7 facility is projected to achieve a monthly output of 50, 000 units by late 2026. Interestingly, it appears that Apple will maintain the RAM capacity at 12GB across these models, adhering to the current specifications instead of enhancing them for the new generation.

Pending Details on Other iPhone 18 Models

As speculation continues, it remains unclear whether the more affordable models within the iPhone 18 lineup will feature chipsets incorporating WMCM technology. There is a possibility that Apple may opt for the older Integrated Fan-Out (InFo) packaging for these variants, thereby optimizing production and design costs. Answers to these pressing questions are anticipated when the iPhone 18 series is officially unveiled in Q4 of 2026. For now, enthusiasts and industry watchers alike should stay tuned for further updates.

For more information, check out the source: China Times

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