Xiaomi’s Upcoming 3nm Chipset to Feature Unreleased MediaTek 5G Modem for Enhanced Speed Performance

Xiaomi is poised to make headlines in the tech industry next year as it plans to introduce its own custom silicon, potentially utilizing an advanced 3nm manufacturing process. Although details regarding the specific foundry partner remain undisclosed, there are several challenges ahead, including navigating possible trade sanctions imposed by the United States. A crucial decision for Xiaomi will be the selection of a 5G modem to complement its System on Chip (SoC). Recent reports indicate that Xiaomi is likely to collaborate with MediaTek for this purpose.

Introducing the MediaTek T90: A High-Performance 5G Modem for Xiaomi’s SoC

According to recent information shared on Weibo by a user identified as a reputable source in the semiconductor industry, Xiaomi’s upcoming 3nm chipset is expected to integrate the MediaTek T90 5G modem. This insight raises expectations surrounding the performance and efficiency of Xiaomi’s latest SoC. MediaTek’s official products page lists the T830 as its most recent 5G baseband solution, hinting that the T90 may still be in development and not yet publicly announced.

Efforts to uncover additional details about the T90, including specifications or a user manual, have yielded no results. This absence indicates that Xiaomi’s new chipset is likely to leverage an unannounced MediaTek component. With an objective to enhance the SoC’s wireless performance substantially, Xiaomi’s strategy appears directed at rivaling industry leader Qualcomm, particularly in the arena of 5G modem technology.

By aligning with TSMC’s state-of-the-art fabrication techniques, MediaTek is well-positioned to supply Xiaomi with its T90 modem. However, the particulars surrounding this collaboration are still largely speculative, leaving many questions unanswered. As developments unfold, tech enthusiasts and industry observers hope for a successful launch that enables Xiaomi to reduce its reliance on Qualcomm and other competitors, while avoiding potential U.S. sanctions.

For further insights, refer to the source discussed: Mobile phone chip expert. Additional information can be found in our previous coverage here: Source & Images.