
Xiaomi’s recent trademark filing for the XRING 02, noted in June, signals the company’s commitment to quickly launch the successor to the XRING 01. New reports suggest that Xiaomi is not only speeding up this launch but is also actively working towards eliminating its dependence on companies like Qualcomm and MediaTek by developing its first in-house 5G modem to accompany its custom silicon initiatives.
Future Lithography and Development Potential
Details concerning the lithography process for the XRING 02 have yet to be disclosed. However, should the U. S.relax its export restrictions, Xiaomi may have the opportunity to utilize TSMC’s cutting-edge 2nm technology for this upcoming model.
The hints about the development of this proprietary chipset surfaced from a Weibo user known as Smart Pikachu. This source indicates that Xiaomi is endeavoring to create a new 5G baseband System on Chip (SoC) that is expected to be integrated directly into the XRING 02. Presently, the XRING 01 relies on MediaTek’s T800 5G modem, which, being an external component on the logic board, tends to consume more power and space—attributes that are less than ideal for a flagship device.
By incorporating an in-house 5G modem, the XRING 02 could potentially offer more internal space for larger batteries or additional features while consuming less energy overall. This strategic move not only enhances the device’s performance but also allows Xiaomi to cut costs associated with dependence on external suppliers like Qualcomm and MediaTek, underscoring the benefits of developing proprietary silicon technology despite the challenges of initial development.

It is important to note that creating a custom 5G modem involves complexities that differ significantly from developing a chipset. Apple faced significant hurdles while developing its C1 modem, spending upwards of $10 billion over the years. In contrast, Xiaomi has historically managed to achieve significant technological advancements with a fraction of that investment. This signifies Xiaomi’s potential to navigate the 5G modem development process while maintaining financial efficiency.
Moreover, emerging reports suggest that the XRING 02 might not be limited to future smartphones and tablets from Xiaomi; it could also find applications in the automotive sector. Given the extensive regulatory frameworks and validation processes that must be navigated, it may take additional time before the company’s second-generation in-house SoC becomes available. Furthermore, the decision regarding which lithography Xiaomi will adopt for the XRING 02 remains uncertain, hinging on possible U. S.export policy changes that could allow access to TSMC’s advanced 2nm fabrication process.
For more insights, readers can refer to the original source: Smart Pikachu
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