Xiaomi XRING 01: The Smallest 3nm Chipset with 109mm², Outpacing Apple A18 Pro; Dimensity 9400 as the Largest SoC

Xiaomi’s decision to utilize TSMC’s innovative second-generation 3nm process, referred to as N3E, for its XRING 01 chipset has resulted in a staggering density of 19 billion transistors within a compact die size. This engineering achievement not only highlights Xiaomi’s capabilities in semiconductor design but also positions the XRING 01 favorably against competitors using the same lithography. Notably, this new System on Chip (SoC) is smaller than several prominent rivals, including the Apple A18 Pro, Dimensity 9400, and Snapdragon 8 Elite, sparking interest in the distinct characteristics of these four chipsets.

Analyzing Chip Sizes: XRING 01 vs. Competitors

A recent die size comparison conducted by tech enthusiast Geekerwan reveals that the Apple A18 Pro, measuring 110mm², is only slightly larger than the XRING 01. Following this, the Snapdragon 8 Elite comes in third at 124mm², while the Dimensity 9400 boasts the largest size at 126mm². This analysis raises an important question regarding Xiaomi’s strategic choice to minimize the dimensions of the XRING 01: cost efficiency.

By keeping the die size smaller, Xiaomi mitigates production costs significantly, especially since the XRING 01 is expected to be produced in limited quantities. A larger die would inherently result in higher manufacturing expenses, challenging Xiaomi’s financial strategy. However, manufacturers of larger dies often reap advantages like enhanced cache sizes, leading to improved overall performance—a trade-off that Xiaomi had to consciously navigate.

XRING 01 Die Size Comparison — Die size comparison of various chipsets.

This strategic reduction in die size could also explain the architectural design of the XRING 01, which includes a robust 10-core CPU paired with a 16-core GPU. To compensate for the smaller die size, Xiaomi may have opted for an increased core count, which raises questions about potential implications for power consumption—a topic worth exploring in future discussions.

We invite you to examine the die size comparison illustrated above and share your insights in the comments section. How do you see the prospects of the XRING 01 in the context of the competitive landscape?

Source: Geekerwan

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