
Xiaomi’s custom XRING 01 was first introduced by CEO Lei Jun; however, a specific launch date wasn’t disclosed at that time. Fortunately, the recent teaser poster has provided clarity, confirming a launch date and revealing key specifications that many enthusiasts have been eagerly anticipating. Notably, the XRING 01 will be manufactured using TSMC’s advanced second-generation 3nm process, aligning its in-house chipset with competing technologies such as A19, A19 Pro, Snapdragon 8 Elite, Dimensity 9400, and Dimensity 9400+.
Official Launch Date Unveiled: May 22 for the Xiaomi XRING 01
The teaser posters indicate that Xiaomi plans not only to unveil the XRING 01 but also to introduce additional products that will leverage the company’s next-gen in-house technology. One of the enticing details in the teasers is a confirmation regarding the manufacturing process. While earlier rumors suggested a shift to TSMC’s 4nm node, it appears that Xiaomi has opted for the more advanced second-generation 3nm process, which may come as a surprise to competitors.

In contrast to the Snapdragon 8 Elite, the XRING 01 will not include proprietary cores. Previous benchmark leaks suggest that the system on a chip (SoC) achieves impressive results through a 10-core cluster utilizing ARM’s latest CPU architectures. The response from the U. S.government regarding this announcement is uncertain; however, one speculation points to a desire by Xiaomi to avoid attracting negative attention by potentially employing the 4nm process instead of moving to the cutting-edge 3nm technology.

The unveiling of this teaser suggests that Xiaomi is poised to position itself as a formidable competitor in the technology landscape and is committed to reducing its reliance on Qualcomm and MediaTek. As silicon prices continue to rise due to the shift towards advanced manufacturing processes, it is crucial for Xiaomi to adopt innovative chip-making strategies. This proactive approach is essential for maintaining competitive pricing on flagship devices.
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