Xiaomi Files Trademark for ‘XRING 02,’ Indicating Development of XRING 01 Successor Amidst Lack of Specification Details

Xiaomi has taken a significant step forward with its introduction of the in-house 3nm XRING 01 chipset, marking a pivotal shift towards reducing its dependence on external chipset manufacturers such as Qualcomm and MediaTek. However, this ambitious plan hinges on the successful development of successors to its custom System-on-Chip (SoC).Recent leaks suggest that Xiaomi has already initiated work on the XRING 02, revealing that the trademark for this new silicon has been officially filed, alongside additional intriguing details.

New Developments: Trademark Filings for XRING 02 and More

A collection of images shared by an insider, @faridofanani96, on the platform X has shed light on the XRING 02 trademark filing, which appeared on the Chinese intellectual property platform TianYanCha. In addition to XRING 02, Xiaomi has also secured trademarks for names such as XRING T1 and XRING 0. Notably, the revelation regarding XRING 02 strongly suggests that the company is actively engaged in developing its future chipsets, reinforcing its commitment to innovation in semiconductor technology.

Technology Specifications: From 3nm to the Future

The XRING 01 is built on TSMC’s second-generation 3nm process, which indicates that the XRING 02 could either leverage the newest third-generation 3nm node, known as ‘N3P’, or potentially move towards the pioneering 2nm technology, depending on the timeline for its rollout. However, there are challenges ahead for Xiaomi. Due to the U. S.restrictions on the export of specialized Electronic Design Automation (EDA) tools critical for semiconductor fabrication, the company faces significant hurdles in utilizing the 2nm process for the XRING 02.

Xiaomi Xring O2 pic.twitter.com/xvN3yNIMba

— Mochamad Farido Fanani (@faridofanani96) June 24, 2025

Potential Paths Forward: TSMC’s 3nm N3E Process

As a consequence of these restrictions, Xiaomi may have to rely on TSMC’s 3nm N3E process for the XRING 02, which, while advanced, may not be sufficient to keep pace with competitors like Qualcomm’s Snapdragon 8 Elite Gen 3 and Apple’s A20 series, which are expected to adopt TSMC’s state-of-the-art 2nm node. However, unlike some competitors such as Huawei and SMIC, Xiaomi is not currently on Taiwan’s export control list, allowing it the possibility to import EDA tools provided it secures a necessary license. This gives Xiaomi a fighting chance to maintain competitive throughput in terms of lithography, although a clearer understanding of its position will only emerge in the coming months. Stay tuned for updates on this exciting development in Xiaomi’s semiconductor journey.

Source & Images