Unveiling Huawei’s Kunpeng 930: The Fastest Server Chip with 120 TaiShan Cores and 364MB L3 Cache Built on TSMC’s 5nm Technology

Huawei continues to push the envelope in computing technology, highlighted by a recent teardown of its latest server chip, revealing remarkable enhancements.

Huawei’s Latest Server Chip Significantly Advances Through Chiplet Architecture

The Kunpeng 920 previously garnered attention for its advanced 7nm technology and ARM-based architecture, establishing a strong presence in the computing market. Now, technology enthusiast @Kurnalsalts has acquired Huawei’s latest Kunpeng 930 server chip, performing a comprehensive teardown that examined the CPU’s packaging and its memory and I/O configurations. Initial results indicate substantial generational upgrades.

Huawei New server chipKunPeng 930Tech：CPU Die ：TSMC N5 FamilyIO Die ： SMIC 14?Analyze chip Video in Bili and Youtubehttps://t.co/948uriMwgo pic.twitter.com/ktsJ6DLhgy

— Kurnal (@Kurnalsalts) August 25, 2025

Starting with the chip package, it spans an impressive 77.5mm x 58.0mm, largely attributable to Huawei’s innovative chiplet design composed of four distinct dies. The package features four compute chiplets, each measuring approximately 252.3 mm², coupled with a sizable I/O die, which measures around 312.3 mm². Notably, the Kunpeng 930’s I/O die area is approximately 81.26% larger than that of its predecessor, the Kunpeng 920, primarily due to its enhanced capability of supporting 96 channels for memory connectivity.

Huawei Kunpeng 930 Motherboard Platform | Image Credits: Kurnal

The CPU die measures 23.47mm × 10.75mm and incorporates ten CPU clusters, each containing four cores. This results in a total of 120 cores for the Kunpeng 930. Each die is equipped with a substantial amount of cache, including 91MB L3 and 2MB L2 cache. A closer inspection reveals that the chip employs Huawei’s proprietary ‘Mount TaiShan’ core architecture, which are specialized ARM server cores developed in-house.

Kunpeng 930 CPU die teardown | Image Credits: Kurnal

Regarding input/output capabilities, the Kunpeng 930 supports 96 PCIe lanes and features 16-channel DDR5 memory support, utilizing a dual-socket motherboard configuration. In comparison with its predecessor, this latest model boasts nearly double the core count, significant improvements in both L3 and L2 cache configurations, and enhanced SRAM density, all made possible by the advanced TSMC N5 manufacturing process.

While Huawei still trails behind its Western competitors, the Kunpeng 930 stands as a formidable option for domestic markets, effectively competing against previous generation offerings from AMD and Intel. This teardown not only highlights Huawei’s technological advancements but also indicates that the tech giant is poised to continue innovating in the computing realm.

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