TSMC CoWoS Packaging Supplier Sues Former General Manager, Denies Technology Transfer to China

GPTC Denies Technology Leak to China, Initiates Lawsuit Against Former GM

Grand Process Technology Corporation (GPTC), a prominent supplier for TSMC’s Advanced Packaging technologies, including the Chip-on-Wafer-on-Substrate (CoWoS) solution, has firmly denied allegations suggesting that sensitive technology has been compromised and leaked to China. The company issued an official statement addressing the circulating rumors, asserting that no evidence of technology transfer has been found.

A person wearing a light blue shirt and dark blue lanyard stands against a plain background. — Image Source: LTN

Concurrently, GPTC has filed a lawsuit against its former General Manager, Huang Fu-Yuan. The lawsuit alleges that Huang was implicated in potential breaches of trade secrets associated with the company’s operations. As the case progresses into the Judicial Investigation phase, GPTC stated it is legally bound not to reveal further details about the ongoing proceedings.

Advanced packaging process equipment manufacturer GPTC (3131), a supplier of CoWoS for TSMC (2330), has addressed rumors regarding the alleged leakage of key technology to China. The firm confirmed through a press release that no significant information has been reported as transferred.

via LTN

In the interest of safeguarding its interests, GPTC has expressed full commitment to cooperating with legal authorities investigating the matter. The company emphasized that all employees are expected to adhere strictly to internal regulations to ensure compliance and protect valuable intellectual property.

Initial findings suggest that no significant transfers of proprietary technologies, including specialized equipment or manufacturing techniques, have occurred with respect to China. The media coverage surrounding this issue appears to be largely speculative; however, the initiation of a legal process against a high-ranking official raises valid concerns, especially considering the past instances of information leaks involving TSMC employees.

It is worth noting that in recent times, China has faced numerous trade restrictions imposed by the U. S.government. These restrictions have prompted Chinese firms to attempt to recruit TSMC employees in efforts to tap into their knowledge of advanced fabrication and packaging techniques. Furthermore, China has also been barred from acquiring the highly advanced machinery and tools from ASML necessary to innovate its chip manufacturing capabilities.

For additional details, visit Dan Nystedt’s article.

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