TSMC Unveils Next-Gen Chip Production Plans: 2nm Technology Set for Arizona by Next Year, A14 (1.4nm) Expected in Taiwan by 2028

TSMC is rapidly entering the ‘Angstrom-era’ of semiconductor manufacturing. Recent reports indicate that the company is initiating preparations for advanced A16 and A14 processes at its facilities in Taiwan.

Enhancing Competition: TSMC’s Strategy for the Angstrom Era and U. S.Expansion

The Taiwanese semiconductor giant is strategically advancing its production capabilities, setting a pace that outstrips its competitors. Despite geopolitical concerns surrounding its operations, TSMC’s development efforts continue unabated. A new report by Ctee highlights the company’s initiative to ramp up chip production, particularly at its significant Fab 22, which is being prepared for A14 manufacturing. Notably, TSMC’s production in the U. S.is also accelerating, with plans for a 2nm node expected to debut in Arizona by next year, nearly one year ahead of its original schedule.

Focusing on Taiwan, TSMC’s facility in Kaohsiung is gearing up to establish six new fabs. Five of these will be dedicated to the mass production of 2nm technology and the A16 node (1.6nm), while the sixth focuses on the advanced A14 node (1.4nm), anticipated to achieve high-volume manufacturing (HVM) by 2028. This Kaohsiung facility represents a monumental investment by TSMC, amounting to over NT$1.5 trillion (approx.$50 billion), positioning it at the forefront of the emerging Angstrom era.

Rapidus semiconductor facility in Japan aiming for 2nm chip mass production by 2027 amid competition from TSMC and Samsung

Turning to TSMC’s Arizona operations, it has been confirmed that the company plans to introduce both 2nm and A16 technologies, along with the establishment of Fabs 3 and 4 shortly. Production for N2 is projected to commence in the second half of 2026. However, challenges remain in scaling production capacity, particularly with ongoing construction of essential infrastructure like plumbing and electrical systems. Given the U. S.government’s influence, pushing for a balanced treatment of both Taiwan and U. S.operations, TSMC’s momentum in these developments is expected to be substantial.

In comparing TSMC to its competitors, the landscape appears to favor TSMC, unless other firms, such as Intel Foundry Services (IFS), can introduce truly groundbreaking process nodes. Intel’s 14A node is slated for high-volume manufacturing in 2028, coinciding with TSMC’s A14 launch, suggesting a potential alignment in technological advancements between these two industry giants.

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