TSMC Launches 2nm Trial Production at Kaohsiung Plant This Month, Exceeding Anticipated Timeline with Initial Goal of 5,000 Wafers

TSMC Launches 2nm Trial Production at Kaohsiung Plant This Month, Exceeding Anticipated Timeline with Initial Goal of 5,000 Wafers

TSMC is positioning its Taiwan facilities as the focal point for pioneering 2nm wafer production. The Baoshan and Kaohsiung plants will lead the charge in this advanced technology segment. Recently, TSMC launched trial production at its Baoshan facility with a target output of 5,000 wafers, marking a significant yield achievement of 60 percent. Following this success, reports indicate that the company has now initiated trial production at its Kaohsiung plant, aiming to mirror the monthly production goal set at Baoshan.

Manufacturing Capacity Expansion Amid Rising Demand

The demand for 2nm wafers is reportedly surpassing that of the prior 3nm generation, prompting TSMC to accelerate its production timeline. According to the latest insights from the Economic Daily News, operations are forecasted to commence later this month, with mass production anticipated to begin later in the year. Notably, Apple is expected to be TSMC’s inaugural customer for these wafers, followed closely by industry players such as Qualcomm and MediaTek. This influx of orders is set to keep TSMC exceptionally busy.

Production Facilities and Future Projections

With the Baoshan and Kaohsiung plants fully operating, TSMC could potentially escalate its monthly wafer production to 40,000 units across six factories. Should demand outstrip these capabilities, there is speculation that TSMC might activate a third facility to meet the increased need. Projections suggest that by 2026, the foundry titan could ramp up its production capacity to an astounding 80,000 wafers per month, comfortably accommodating a large clientele.

Innovation and Cost Efficiency Initiatives

On the cost front, TSMC is unveiling its ‘CyberShuttle’ service in April, enabling key clients like Apple, Qualcomm, and MediaTek to test their chips on a shared wafer. This innovation is expected to streamline processes and reduce production costs significantly. TSMC’s consistent advancements in semiconductor technology are likely to solidify its competitive advantage, especially given Samsung’s relatively slow progress in embracing cutting-edge nodes.

As the semiconductor landscape evolves, TSMC’s strategic initiatives within Taiwan not only address increasing demand but also enhance its reputation as a global leader in chip manufacturing.

News Source: Economic Daily News

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