Thermaltake Announces Compatibility of Existing AIO Coolers with LGA 1954 Socket

Thermaltake Announces Compatibility of Existing AIO Coolers with LGA 1954 Socket

Thermaltake has announced that its latest all-in-one (AIO) cooler will support Intel’s forthcoming LGA 1954 platform, as confirmed on the company’s official website.

Thermaltake Confirms Compatibility of MINECUBE 360 Ultra AIO Cooler with Intel’s LGA 1954 Socket, Supporting Intel Nova Lake

A well-known manufacturer of cooling systems and PC cases, Thermaltake, has officially included the Intel LGA 1954 socket in its compatibility list for the MINECUBE 360 Ultra ARGB Sync cooler. This key announcement, revealed during Computex earlier this year, signifies that the cooler will not only work with the existing LGA 1851 socket but will also accommodate the upcoming Intel Nova Lake processors upon their release.

Compatibility chart showing Intel CPU socket 1954 highlighted in red.
Image Credit: @momomo_us

Previous insights have indicated that the new LGA 1954 socket maintains the same dimensions as its predecessor, LGA 1851, measuring 45mm x 37.5mm—dimensions also shared with the LGA 1700 socket. This uniformity promises straightforward compatibility for the Intel Nova Lake CPUs, especially for those utilizing existing LGA 1851 and LGA 1700 coolers. While cooler manufacturers might need to develop updated mounting brackets for specific Nova Lake CPU configurations depending on hotspots, such adjustments are expected to be manageable and would not necessitate a complete redesign of current cooler models.

Intel Installation Guide with Thermaltake cooler, showing steps for models 1954/1851/1700/1200/115X and screws labeled F and G.
Image Credit: @momomo_us

Renowned leaker @momomo_us has provided insights into the Intel Installation Guide for the MINECUBE 360 Ultra ARGB AIO Cooler. The guide indicates that the same bracket used for the LGA 1851 socket is also applicable for the LGA 1954 socket, easing the transition for cooler manufacturers to the new CPU platform.

This development is particularly encouraging given Intel’s history of frequently altering socket sizes over recent generations prior to the introduction of the LGA 1700, which often complicated the upgrade path for users. Anticipated to launch in approximately one year, Intel’s Nova Lake series promises a significant boost in performance, including an increased core count. Additionally, Nova Lake is expected to debut with dual architecture capabilities for its integrated GPU, featuring both Xe3 and Xe4 technology. On top of these advancements, an enhanced NPU6 designed to replace the NPU5 in the upcoming Panther Lake series will provide improved artificial intelligence functionalities.

For further information, visit the official Thermaltake website.

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