SK Hynix Unveils Second-Generation 3Gb DDR5 “A-Die” Memory Chips with AKBD Bin Indicating Native 7200 MT/s Speed

Second Generation 3Gb A-Die Memory Discovered on Facebook; Could Feature Native JEDEC Speed of 7200 MT/s

A recent discovery on Facebook has unveiled the second generation of 3Gb A-Die memory chips, identified by the label X021 and part code “AKBD”.According to insights shared by @unikoshardware, this new designation indicates a succession to the existing 3Gb M-die variant, which has been a staple in powering early DDR5 memory modules.

SK Hynix employs a systematic naming convention, where combinations like EB, GB, and HB correlate with JEDEC speeds of 4800, 5600, and 6400 MT/s respectively. Following this logic, the introduction of the “KB”designation suggests an anticipated speed of 7200 MT/s for the upcoming memory, highlighting advancements in DDR5 technology.

SK Hynix H5CG08KBD memory chip positioned over a keyboard. — Image Credit: Facebook

This development resonates with Intel’s strategic roadmap, as both the Arrow Lake Refresh and Panther Lake processors are slated to support DDR5 speeds up to 7200 MT/s, marking a notable enhancement from the current Raptor Lake’s DDR5-5600 and Arrow Lake’s DDR5-6400 standards. This points toward the A-Die chips potentially becoming the backbone of high-performance memory kits designed for next-gen Intel CPUs.

However, one user has raised a crucial point regarding the module’s construction. The suspected 8-layer PCB design could impact stability when operating at elevated memory speeds. Although these initial samples from We Hynix showcase the new A-Die ICs, 8-layer PCBs typically face challenges in maintaining stability beyond 8000 MT/s, primarily due to constraints in signal integrity and power delivery.

In contrast, higher-performance DDR5 RAM kits often utilize 10-layer or even 12-layer PCBs, which provide clearer signal paths that are essential for achieving greater memory speeds. Enthusiasts have already demonstrated the capability of exceeding the 12, 000 MT/s threshold, with some even officially surpassing 13, 000 MT/s recently. For We Hynix’s new A-Die “AKBD”chips to realize their full potential, manufacturers may need to deploy these advanced PCB technologies.

Specification	Details
Die Type	SK Hynix 3Gb A-Die (2nd gen)
Marking	X021
Part Code	AKBD
Native Speed (Speculated)	7200 MT/s (JEDEC)
Platform Compatibility	Arrow Lake Refresh, Panther Lake