Samsung Set to Initiate Mass Production of Next-Gen HBM4 Memory in 2026: Includes 24Gb GDDR7 and 128GB+ DDR5 Offerings

Samsung’s Ambitious Plans for Next-Generation Memory Production in 2026

Samsung is gearing up for significant advancements in memory technology, aiming to kickstart the production of next-generation High Bandwidth Memory (HBM4), alongside 24 Gb GDDR7 DRAM and 128GB+ products slated for 2026.

Recent Financial Performance Highlights

In its Q3 2025 earnings report, Samsung reported a remarkable 15.4% increase in revenue, totaling KRW 86.1 trillion. These record-breaking figures were primarily driven by a surge in demand for HBM3E memory and server SSDs, particularly propelling the company due to the growing momentum in artificial intelligence.

Samsung Q3 2025 financial highlights — Samsung’s financial highlights for Q3 2025

Introduction of Next-Gen HBM4 and the 2nm Process

Recently, Samsung unveiled its advanced HBM4 memory solution featuring speeds up to 11 Gbps per integrated circuit (IC).This memory type is positioned as a formidable option for upcoming AI accelerators from industry giants like NVIDIA and AMD, specifically the Rubin and MI400 series. Samples of this cutting-edge HBM4 memory are reportedly being evaluated by AI chip manufacturers for testing and qualification.

In conjunction with the HBM4, Samsung is focused on ensuring a consistent supply of its 2nm Gate-All-Around (GAA) process and HBM4 base die by 2026. The 2nm technology is set to enhance the production of next-generation Exynos and Qualcomm Snapdragon System on Chips (SoCs), with ramp-up expected this quarter.

In Q4 2025, the Business will actively respond to demand from AI and conventional servers with HBM3E, high-density eSSDs, and other leading-edge memory offerings. Additionally, it will continue to expand sales of industry-leading high-value-added server memory products, such as 128GB and higher DDR5, as well as 24Gb GDDR7.

Going forward in 2026, the Memory Business will focus on the mass production of HBM4 products with differentiated performance, while simultaneously aiming to scale out the HBM sales base. In particular, demand for HBM4 is also projected to increase, and the Company plans to proactively respond with capacity expansion in 1c. It will also concentrate on expanding sales of other high-value-added products, such as DDR5, LPDDR5x, and high-density QLC SSDs to meet demand for AI applications.

In Q4 2025, the Business will aim for continued earnings improvement by ramping up mass production of 2nm Gate-All-Around (GAA) products, increasing fab utilization, and optimizing costs.

In 2026, the Foundry Business will focus on providing a stable supply of new 2nm GAA products and the HBM4 base-die, and beginning operations at the Company’s fab in Taylor, Texas in a timely manner.

via Samsung Newsroom

Future Product Impacts and Market Trends

Samsung has identified the critical roles that 128GB+ DDR5 memory and 24Gb GDDR7 DRAM will play in 2026. The anticipated release of new server platforms from AMD and Intel in the latter half of 2026 is expected to significantly elevate market activity.

Samsung prepares for next-gen HBM4 memory production — Samsung’s preparations for mass production of next-gen memory in 2026

The demand for GDDR7 is projected to remain robust, especially among high-end consumers and AI graphics card developers. NVIDIA’s recently unveiled Rubin CPX GPU is an ideal candidate for this memory, which may also cater to upcoming products like the NVIDIA RTX 50 “SUPER”series and potential AMD Radeon “RDNA 5″or “RDNA 4″refreshes. The 24Gb DRAM dies will not only enhance VRAM capacity but also address gaps within mainstream segments.

However, a pressing challenge currently facing the DRAM and SSD market is the overwhelming focus on AI, resulting in escalated prices for consumer-targeted products. Recent reports indicate significant increases in DDR5 memory and SSD prices amid growing shortages, raising concerns for consumers and manufacturers alike. Various major DRAM producers have already informed of upcoming price hikes for DDR5 and DDR4 memory, prompting further scrutiny of market developments in the months ahead.

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