
The highly anticipated launch of the Galaxy S26 early next year may signal the end of Qualcomm’s exclusive hold on chipsets. Recent reports indicate that Samsung is gearing up for mass production of its innovative Exynos 2600 processor. Earlier this year, Samsung unveiled plans for this chipset, which is notable for being its first to feature 2nm Gate-All-Around (GAA) technology. While initial announcements provided insights into its impressive NPU performance improvements over earlier models, new developments suggest Samsung has now overcome previous challenges related to yield issues.
Addressing Overheating with Heat Pass Block Technology
Months ago, analysts reported that Samsung’s progress with its 2nm GAA process was outperforming its earlier 3nm offerings, with an estimated yield of 30%.Although this figure seemed modest, it is likely that the yield rates for the current 2nm GAA implementations have improved since that report. According to a recent update from ETNews, Samsung’s leading foundry is on the verge of initiating mass production of the Exynos 2600, signifying that whatever previous setbacks they faced have been resolved.
The upcoming Galaxy S26 lineup is expected to include both Snapdragon 8 Elite Gen 5 and Exynos 2600 versions, tailored for different global markets. This strategic move not only aims to enhance performance but also targets cost reduction for Samsung in the upcoming financial year. Notably, recent Geekbench 6 benchmarks have surfaced, showing the Exynos 2600 achieving performance figures comparable to an underclocked variant of the Snapdragon 8 Elite Gen 5. These results underscore the potential of Samsung’s 2nm GAA process to compete with TSMC’s upcoming 2nm technology, slated for mass production in the fourth quarter of 2025.
However, Samsung must also work to rebuild its reputation among consumers to secure orders, as success isn’t just about cutting-edge technology but also about restoring brand trust. Historically, the Exynos series has faced criticism for overheating issues. To mitigate these concerns, the report suggests Samsung has integrated Heat Pass Block (HPB) technology into the Exynos 2600 design, which is intended to enhance thermal management. It is important to note that while HPB technology has been discussed in prior contexts, most of the current insights seem to reinforce earlier information. Given the reliability of the information source, readers should approach these claims cautiously, and we will continue to provide updates as they arise.
For more information, see the original report at ETNews.
Leave a Reply