Samsung Plans Transition from Silicon to Glass Interposers by 2028 for Enhanced AI Chips, Cost-Effective Manufacturing, and Semiconductor Innovation Leadership

Samsung Electronics is poised to make significant strides in semiconductor innovation by initiating the adoption of glass substrates in chip packaging by 2028. This transformative move will mark a significant departure from traditional silicon-based interposers, representing the company’s first formal roadmap for this technological evolution, as reported by ETNews.

Revolutionizing AI Chip Packaging with Glass Interposers

Interposers play a crucial role in 2.5D chip packaging, particularly within the AI semiconductor sphere, where graphics processing units (GPUs) are paired with high-bandwidth memory (HBM).These interposers act as connectors, enhancing communication speed between components. Despite the effectiveness of traditional silicon interposers, their high costs have become a concern in light of the rapidly expanding AI industry. In contrast, glass interposers not only reduce expenses but also offer heightened precision for intricate circuits and greater dimensional stability.

The advantages of glass interposers clearly position them as the ideal choice for next-generation AI chips. An industry insider remarked, “Samsung has established a plan to transition from silicon interposers to glass interposers in 2028 to meet customer demands.” This strategic direction aligns with similar initiatives from competitors such as AMD, indicating a significant trend shift in semiconductor technology.

As the semiconductor industry gradually begins to embrace glass substrates, Samsung’s approach stands out. The company is developing compact glass substrates measuring under 100x100mm, which accelerates prototyping processes, in contrast to the larger 510x515mm glass panels typically employed. Although this smaller substrate size might impact efficiency, it enables Samsung to enter the market with greater agility.

Additionally, Samsung is leveraging its Cheonan campus panel-level packaging (PLP) line, which utilizes square panels in place of traditional round wafers. This strategic positioning allows Samsung to establish a competitive advantage in the AI sector. Moreover, this initiative complements the company’s integrated AI solutions strategy, consolidating foundry services, HBM memory, and advanced packaging capabilities under a unified framework.

Given the rapid expansion of the AI industry, Samsung’s initiative to transition to glass substrates for interposers positioned it favorably against competitors in the long term. As the technology matures, the potential for increased external orders could significantly enhance the company’s revenue streams. Stay tuned as we monitor this pivotal transition and provide further updates.

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