Samsung HBM4E Promises Impressive 3.25 TB/s Bandwidth; Nearly 2.5 Times Faster Than HBM3E, Elevating AI Computing Performance

At the recent Open Compute Project (OCP) Global Summit, Samsung emerged as a frontrunner in the memory manufacturing sector by unveiling significant advancements in High Bandwidth Memory (HBM), specifically in their upcoming HBM4E technology. This new generation of memory promises to deliver remarkable enhancements over its predecessors.

Samsung’s HBM4E: A Leap in Memory Technology with Unmatched Speed

Samsung has been actively advancing its HBM offerings, recently securing pivotal contracts with major players like NVIDIA and AMD. At the OCP event, the company illuminated the future trajectory of its HBM series, emphasizing the impressive specifications of both HBM4 and the next-generation HBM4E. Notably, HBM4E is set to achieve pin speeds of 13 Gbps per stack, translating to an astonishing bandwidth of 3.25 TB/s, which is a substantial upgrade in performance metrics.

Samsung HBM4 and HBM4E memory showcased at a presentation, highlighting specifications such as Density per Slice and Logic Process Change. — Details of Samsung HBM4E | Image Credits: Sedaily

Additionally, the HBM4E module boasts impressive power efficiency, reportedly achieving nearly double the efficiency of the existing HBM3E. Samsung’s HBM4 process has also set new benchmarks, reaching a pin speed of 11 Gbps, surpassing the established standards defined by organizations such as JEDEC. This breakthrough aligns with NVIDIA’s demand for enhanced HBM4 solutions to improve the performance of its Rubin architecture, and according to local media, Samsung has pioneered this advancement.

Samsung Electronics, having previously lagged behind its rivals in the HBM3E sector, has fiercely pursued higher bandwidth capabilities since the inception of its HBM4 development. As their speed competition in HBM4 nears success, the company’s strategy is to maintain momentum in advancing to the next generation.- Sedaily

In addition to performance boosts, Samsung is also focusing on establishing a competitive pricing structure for HBM4 supplies to companies like NVIDIA. With advanced semiconductor technology (4nm) being an integral component of HBM4, Samsung’s in-house foundry capabilities enable better profit margin control over the production of these modules.

As for the market introduction of HBM4E, it is projected to debut in early 2026, coinciding with the mass production timeline for HBM4 technology.

For further details, refer to the news source: Sedaily.

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