Samsung Exynos 2700 Chip Features SF2P Process, ARM Cortex C2 Cores, Enhanced Thermals, LPDDR6, UFS 5.0, and Internal Codename Ulysses

Samsung’s upcoming Exynos 2700 chip, designed for a potential 2027 release, promises to bring significant enhancements, particularly in thermal management. Building on the foundation set by the Exynos 2600, which will power the standard Galaxy S26 and Galaxy S26+ in certain markets, this new system-on-chip (SoC) features a state-of-the-art copper-based heat sink that is directly integrated with the application processor (AP).Despite the innovations introduced with the Exynos 2600, there are still areas for improvement that the Exynos 2700 is expected to address, leading to higher performance and efficiency.

Exynos 2700: Focused on Thermal Efficiency and Design Innovation

Technical analysis of the Exynos 2700 (codenamed Ulysses), Samsung’s SoC planned for 2027. The project prioritizes the resolution of thermal bottlenecks through simultaneous advancements in lithography, core architecture, and physical packaging.pic.twitter.com/3RTkGJdUq2

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Recent leaks from a less known but credible source have surfaced key specifications of the Exynos 2700, internally referred to as Ulysses. This information, amplified by connections to established leakers, suggests that the new chip will build on the technological advancements of its predecessor.

To start, the Exynos 2700 is set to use Samsung’s cutting-edge SF2P process, representing the evolution of the already impressive 2nm Gate-All-Around (GAA) technology implemented in the Exynos 2600.

The GAA architecture features a unique 3D transistor design where the gate envelops the channel, enhancing electrostatic control while concurrently lowering voltage thresholds. The transition to the SF2P process is expected to yield a remarkable 12% boost in overall performance and a 25% decrease in energy consumption compared to the earlier SF2 node.

An exciting aspect of the Exynos 2700 is its anticipated core architecture. It is likely to incorporate ARM’s new naming convention, transitioning from Cortex labels to C2 cores. The configuration could include C2-Ultra and C2-Pro cores, with clock speeds potentially reaching 4.20GHz, a significant enhancement over the 3.90GHz maximum of the Exynos 2600.

Architectural Breakdown of Exynos 2700

1x C1-Ultra core at 4.20GHz (expected)
3x C1-Pro cores at 3.25GHz
6x C1-Pro cores at 2.75GHz
Samsung Xclipse 960 GPU (exact clock speeds not disclosed) featuring ray-tracing support
AI Engine with a 32K Mac Neural Processing Unit (NPU)
Support for LPDDR5X RAM

It’s reasonable to assume that the Exynos 2700 will continue with a similar core configuration as its predecessor for consistency and performance. By leveraging the latest ARM C2 cores, we could see an incredible IPC (Instructions Per Cycle) enhancement approaching 35%.

The theoretical performance assessments indicate that the expected clock speed boosts could translate into a Geekbench 6 score of around 4, 800 for single-core tasks and 15, 000 for multi-core operations, signifying increases of approximately 40% and 30%, respectively, over the Exynos 2600.

A labeled diagram illustrates 'FOWLP-SbS Packaging' featuring components DRAM, Die, and SbS (Unified HPB) with visual thermal indicators. — FOWLP-SbS Packaging

In a significant design evolution, the Exynos 2700 is poised to incorporate FOWLP-SbS (Side-by-Side) packaging technology, which integrates a unified Heat Path Block. This copper heat sink covers the entire AP, as opposed to the partial coverage provided in the Exynos 2600, thereby enhancing heat dissipation capabilities.

A diagram highlighting the Samsung Exynos 2700 with 'HIGH LOAD OPERATIONAL STABILITY', showing CPU (C2 Ultra), GPU (Xclipse), LPDDR6 memory, and UFS 5.0 storage under 'SbS (SIDE-BY-SIDE) PACKAGING LAYOUT' with 'HUGE JUMP IN BANDWIDTH

In terms of graphics, the Exynos 2700 is expected to utilize an AMD architecture-based Xclipse GPU, capitalizing on the increased data transmission capabilities of LPDDR6 and UFS 5.0. These advancements could provide a performance uplift ranging from 30% to 40%, with LPDDR6 achieving throughput rates of up to 14.4 Gbps. Notably, there are speculative discussions about Samsung potentially developing an in-house GPU for the Exynos 2800 chip in the future.

Despite the months remaining until the formal announcement of the Exynos 2700, many questions remain unanswered, particularly regarding the integration of a modem. The choice between an integrated versus an external modem could sway efficiency and yield metrics in the manufacturing process.

If these developments come to fruition, the Exynos 2700 could emerge as a formidable competitor to Qualcomm’s next Snapdragon 8 Elite Gen 5 chip, paving the way for Samsung to potentially lessen its reliance on Qualcomm amidst the competitive landscape.

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