Recent reports from South Korean media reveal that Samsung has successfully obtained HBM3E supply from NVIDIA, a pivotal achievement for the company following the recent qualification of its 12-Hi variant. This advancement marks a significant milestone in the ongoing partnership between the two tech giants.
Samsung Achieves HBM3E Qualification From NVIDIA; Aims to Broaden HBM4 Market Presence
The saga surrounding NVIDIA and Samsung’s collaboration has evolved over recent months, highlighting several challenges and milestones. Initially, Samsung faced difficulties securing a position within NVIDIA’s supply chain, hindered by thermal issues related to its HBM3 technology derived from DRAM innovations.
Following the setbacks with HBM3, Samsung attempted to pivot by introducing 8-layer HBM3E. However, this effort was also thwarted due to reliance on older 1a DRAM “4th-generation”technology, which continued to present performance and thermal challenges. In response, Samsung embarked on an ambitious redesign of its DRAM architecture, coupled with significant investments in its high-bandwidth memory (HBM) division. This strategic shift was driven by a blend of technological ambition and the desire to generate substantial revenue from HBM sales.
For Samsung, the supply is less about revenue and more about pride. Recognition from Nvidia means its technology is back on track.
With this recent breakthrough, Samsung expresses confidence in its ability to enter the HBM4 market alongside its competitors. Significantly, the company claims to be the first to achieve 11 Gbps speeds with its upcoming HBM4 technology, thanks to advancements such as the utilization of 1c DRAM technology and a state-of-the-art 4nm logic die from Samsung Foundry. Looking ahead, the HBM4 supply could potentially expand to key industry players, including AMD, Broadcom, and Google.
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