NVIDIA Plans to Revamp Cooling Systems for Next-Gen Rubin Ultra Amidst Thermal Challenges

NVIDIA is gearing up to implement a cutting-edge cooling solution for its upcoming Rubin Ultra AI lineup. This transition aims to address the increasing power requirements and thermal challenges posed by the next generation of GPUs.

NVIDIA’s Shift to Microchannel Cover Plates for Enhanced Cooling Efficiency

Understanding the importance of effective cooling solutions is essential in today’s rapidly advancing GPU market. As NVIDIA continues to elevate performance with each release, the power draw associated with its products, such as the Rubin series, has become a significant challenge. Recent insights from @QQ_Timmy suggest that NVIDIA is collaborating with cooling partners to incorporate ‘direct-to-chip’ cooling systems via microchannel cold plates in their Rubin Ultra AI GPUs. This marks a notable departure from conventional liquid cooling methods, potentially allowing NVIDIA to achieve exceptional performance levels.

Excessive Concerns Over Microchannel Cover Plate Issues; Growth in Rubin GPU and ASIC Demand to Boost Liquid Cooling Revenue in 2026. The market previously rumored that cooling for the Rubin GPU (TDP 2.3kW) might adopt a microchannel cover plate (MCL), but recent updates… pic.twitter.com/JFCj1Yrc6C

— Shun HaYaO (@QQ_Timmy) October 4, 2025

Microchannel cover plates (MCCP) function similarly to direct-die cooling techniques, popularly utilized by overclocking enthusiasts with modern CPUs. This innovative approach employs a copper cold plate featuring intricate microchannels that facilitate coolant circulation. Such a design promotes localized convection, significantly reducing thermal resistance from the die to the coolant. While this method retains some elements of NVIDIA’s existing cooling systems, the new implementation directly targets liquid-cooled plates mounted on the chip, optimizing thermal management efficiency.

To fully grasp the necessity of MCCP technology, one must consider NVIDIA’s rapid product release strategy. Transitioning from the Blackwell architecture to Rubin necessitates managing heightened power demands, especially within complex rack-scale configurations. Consequently, NVIDIA is compelled to explore out-of-the-box solutions for advanced cooling technologies, serving as an unavoidable response to architectural advancements.

Rubin Ultra NVL576 presentation with specifications like '15 EF FP4 Inference' and '115.2 TB/s CX9 8X' — Image Credits: NVIDIA

Reports indicate that NVIDIA has reached out to Asia Vital Components, a Taiwanese provider of thermal solutions, to develop the MCCP technology for its Rubin Ultra series. Originally intended for Rubin, the tight development timelines have allowed insufficient time for suppliers to transition fully to this advanced cooling solution. Interestingly, this conversation mirrors recent innovations by Microsoft, which unveiled a microfluidic cooling system akin to MCCP. However, Microsoft’s approach focuses more on ‘in-chip cooling’ wherein the coolant is embedded within or on the back of the silicon itself. This shift underscores the industry’s pressing need for novel cooling technologies.

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