Recent leaks concerning NVIDIA’s anticipated GeForce RTX 5090 GPU have unveiled significant details, particularly regarding the PCB layout, power stage configurations, and overall architectural enhancements.
Unveiling the NVIDIA GeForce RTX 5090: Enhanced Power and Innovative Design
As the release date of NVIDIA’s RTX 50 “Blackwell”flagship GPU draws nearer, specifications are becoming clearer. The latest insights from Benchlife suggest that Team Green will implement a distinctive 16+6+7 power phase design, marking a notable shift from the configuration utilized in the RTX 4090, which used a 20+3 layout.
Further predictions indicate that the RTX 5090 may sport a robust 14-layer PCB design, although this may vary by model; the reference model currently appears to be the focus of these discussions. Alongside these specifications, previous rumors have been corroborated, leading to a comprehensive overview of what this flagship GPU promises:
- Architecture: Blackwell GB202-300
- Memory: 32 GB GDDR7
- Thermal Design Power (TDP): 600W
- Power Phase Configuration: 16+6+7
- Power Connector: 1x 12V-2×6 (16-pin)
- Interface: PCIe 5.0 Express slot
For more detailed insights into performance and pricing expectations for the GeForce RTX 5090, you can explore our comprehensive roundup. Recent revelations have also provided a captivating first look at its PCB design, showcasing not only an enlarged onboard silicon but also a reinforced integrated heat spreader (IHS) designed to manage the GPU’s thermal needs effectively. As a result, gamers can anticipate significant advancements in performance, potentially establishing the RTX 5090 as a leading contender in the high-end GPU market.
Set for launch between late January and early February, the NVIDIA GeForce RTX 5090 is poised to make waves in the gaming community. Keep an eye out for more updates regarding the next-gen lineup, particularly as announcements are expected at CES 2025, just weeks away. Excitement certainly surrounds this upcoming release.
Source of News: Videocardz
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