NVIDIA Champions ‘Made in USA’ as Jensen Huang Reveals First Blackwell Chip Wafer Manufactured by TSMC in Arizona

NVIDIA’s CEO has announced a groundbreaking milestone: TSMC has successfully produced the first Blackwell chip wafer in the United States, marking a significant advancement in domestic semiconductor manufacturing.

TSMC Arizona Launches the First Blackwell Chip Wafer in the U. S.

Since the beginning of the Trump administration, a strategic push to revitalize U. S.manufacturing has reshaped the landscape of the tech industry, with NVIDIA at the forefront of this initiative. The company has pledged a staggering $500 billion towards fortifying American manufacturing capabilities, prompting major suppliers such as Foxconn and Quanta to establish operations within the U. S.In a recent blog post from NVIDIA, it was revealed that TSMC’s Arizona facility has commenced production of the Blackwell chip, culminating in a visit from Jensen Huang to Phoenix to commemorate this pivotal achievement.

This is a historic moment for several reasons. It’s the very first time in recent American history that the single most important chip is being manufactured here in the United States by the most advanced fab, by TSMC, here in the United States.

This is the vision of President Trump of reindustrialization — to bring back manufacturing to America, to create jobs, of course, but also, this is the single most vital manufacturing industry and the most important technology industry in the world.- NVIDIA’s CEO Jensen Huang

CEO Jensen Huang was joined by Ray Chuang, the CEO of TSMC Arizona, who praised the rapid advancements in U. S.manufacturing. The commencement of Blackwell chip wafer production signifies that NVIDIA and its partners are now capable of providing the most advanced AI chips domestically. Just a few years ago, such accomplishments might have seemed impossible. Notably, NVIDIA has announced that TSMC intends to integrate advanced production capabilities for “two-, three-, and four-nanometer chips, along with A16 chips”at the Arizona facility in the near future.

Blackwell Die Wafer by TSMC on manufacturing equipment. — Image Credits: TSMC

For context, TSMC Arizona announced its ambition to produce Blackwell chips in April. Impressively, the facility has achieved its first chip wafer within just six months—a feat that highlights the company’s exceptional capabilities. While wafer production is a critical step in chip manufacturing, it is only the beginning; subsequent phases like layering, patterning, etching, and dicing are essential for transforming these wafers into functional AI chips.

Looking ahead, TSMC’s expansion in the U. S.shows no signs of slowing. The semiconductor industry giant has plans to implement leading-edge processes in the United States, including the A16 process (1.6 nm), positioning America as a vital player in the global semiconductor arena, alongside Taiwan.