NVIDIA B30A ‘Blackwell’ Chip for China: Dual-Die Design, 8-Hi HBM3E, and TSMC N4P Process Expected to Launch by Q4 2025

NVIDIA is gearing up to release its forthcoming Blackwell chip, designated the B30A, specifically targeting China’s burgeoning AI sector. This innovative chip is expected to incorporate HBM3E memory and showcase enhanced performance due to notable architectural improvements.

Exploring NVIDIA’s B30A: Major Enhancements Expected Over the H20 Due to Chiplet Architecture

Recent discussions have focused on NVIDIA’s strategic moves within the Chinese AI marketplace. To sustain its position as a market leader, the company must deliver impactful solutions promptly. A detailed analysis from GF Securities suggests that the B30A chip is poised to be NVIDIA’s flagship product for this region. This new entrant will feature specifications akin to the H20 AI chip, including an 8-Hi HBM3E configuration, TSMC’s advanced N4P manufacturing process, and NVLink interconnect technology. However, the standout feature will be the significant performance boost attributed to the new Blackwell architecture.

(GF)NVDA GPU Analysis😏 pic.twitter.com/ME4TXt9u6J

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A key differentiator of the B30 AI chip will be its dual-die architecture, diverging from the H20’s monolithic structure. This innovative design positions the B30A competitively alongside the B200 and B300 models, effectively enhancing performance metrics. Preliminary assessments indicate that the B30A will have half the specifications of the B300, comprising 141 GB of HBM3E 8-HI memory, and preserving the connectivity excellence of NVLink with a 900 GB/s bandwidth, consistent with the H20’s capabilities.

Chart comparing H20, RTX 6000D, and B30 specifications, including launch dates, architecture, memory bandwidth, and more. — Image Credits: GF Securities

NVIDIA’s emphasis on a dual-die design signifies its intent to establish a competitive edge over the H20 model. Given the stark performance differences observed between the Hopper and Blackwell generations, the B30A is anticipated to attract substantial interest among Chinese enterprises. GF Securities projects that the Blackwell chip may make its debut by Q4 2025, necessitating that NVIDIA’s leadership expedite efforts to secure regulatory approvals from the U. S.administration.

The forthcoming specifications of the B30A chip remain eagerly anticipated, especially as Chinese AI companies increasingly seek alternatives to NVIDIA’s offerings. To maintain its foothold, Team Green must hasten its entry into the Chinese market with a robust Blackwell solution.

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