AMD is gearing up to launch its next-generation EPYC processors, leveraging the new SP7 socket architecture. Notably, the forthcoming Venice “Zen 6″CPUs may demand significant power levels, potentially reaching up to 1400W.
AMD’s Upcoming EPYC Venice “Zen 6″CPUs on the SP7 Socket: Powering Up from 700W to 1400W
During a recent presentation at the OCP APAC Summit, Taiwan Microloops Corp showcased its innovative liquid cooling systems designed for next-generation server applications. The SP7 platform will serve as an upgrade to the currently used SP5 from Genoa and Turin architectures, supporting AMD’s Venice “Zen 6″CPUs which are expected to feature an impressive 256 cores.
While the new EPYC chips promise enhanced specifications including elevated core counts and broader I/O capacities, they are also anticipated to consume considerable power. However, it’s essential to note that higher power consumption doesn’t directly equate to inefficiency. AMD has consistently demonstrated that each generation of EPYC processors offers substantial performance improvements, with an increase in power efficiency alongside the rise in power figures.
Microloops has introduced an advanced cold plate specifically engineered for kW-level cooling due to the demanding thermal requirements of AMD’s SP7 socket. This new cooling solution features an inlet and outlet port, along with robust acrylic cover design and metal reinforcement. The mounting mechanism mirrors that of the previous SP5 configuration, utilizing six mounting screws to ensure stability.
Analysis from the manufacturer indicates that the power scaling for AMD’s EPYC SP7 series begins at 700W, extending up to a remarkable 1400W. This marks a notable increase, given that the current EPYC Turin processors typically peak at 500W. With SP7, the initial threshold already represents a substantial 40% rise.
Although EPYC Turin chips may exceed 500W under specific conditions and have seen Threadripper models surpass 1kW with Precision Boost Overdrive enabled, EPYC processors are not primarily designed for overclocking. Nonetheless, these developments hint at the considerable power potential that next-gen Threadrippers could achieve, possibly reaching between 1000W to 1500W when fully optimized.
In a related discussion at the Hot Chips 2025 conference, FABRIC8LABS proposed a cutting-edge solution that surpasses traditional liquid-cooled cold plates. They highlighted the limitations associated with existing straight channel designs and introduced their Electrochemical Additive Manufacturing (ECAM) process, which can potentially enhance thermal performance by an impressive 20% to 85%.
Utilizing ECAM technology enables the design of innovative cooling channels for both CPUs and GPUs while lowering thermal resistance and opening possibilities for high TDP chips with reduced operating costs. The EPYC Venice processors, built on the Zen 6 architecture, will be the first to leverage the SP7 platform, with the introduction of an SP8 socket aimed at entry-level configurations as well.
These processors are set to launch in the near future, positioning themselves to compete robustly with Intel’s Clearwater Forest Xeon E-Core and Diamond Rapids Xeon P-Core product lines.
News Source: HXL (@9550pro)
Related Articles:
Origin Code Launches VORTEX DDR5: High-Capacity DDR5 Kits with Innovative Active Triple-Fan Cooling
14:29
ASRock’s Amazing 180Hz 27-Inch IPS Monitor Now Available for Under $100
9:03
Record-Breaking DDR5 Memory Overclock Reached at 13,000 MT/s on Gigabyte Z890 AORUS Tachyon – 2.7x Faster than JEDEC Specifications
7:44
Leave a Reply