New AMD EPYC SP7 “Venice” Processors Featuring Up To 256 Zen 6 Cores and 1400W Power Scalability, Showcasing Latest Liquid-Cooled Cold Plate Designs

New AMD EPYC SP7 “Venice” Processors Featuring Up To 256 Zen 6 Cores and 1400W Power Scalability, Showcasing Latest Liquid-Cooled Cold Plate Designs

AMD is gearing up to launch its next-generation EPYC processors, leveraging the new SP7 socket architecture. Notably, the forthcoming Venice “Zen 6″CPUs may demand significant power levels, potentially reaching up to 1400W.

AMD’s Upcoming EPYC Venice “Zen 6″CPUs on the SP7 Socket: Powering Up from 700W to 1400W

During a recent presentation at the OCP APAC Summit, Taiwan Microloops Corp showcased its innovative liquid cooling systems designed for next-generation server applications. The SP7 platform will serve as an upgrade to the currently used SP5 from Genoa and Turin architectures, supporting AMD’s Venice “Zen 6″CPUs which are expected to feature an impressive 256 cores.

Cold plates diagram for AMD SP7 kW-level cooling with Swivel Metal Connector, Outlet, and Inlet labels at OCP APAC Summit 2025.

While the new EPYC chips promise enhanced specifications including elevated core counts and broader I/O capacities, they are also anticipated to consume considerable power. However, it’s essential to note that higher power consumption doesn’t directly equate to inefficiency. AMD has consistently demonstrated that each generation of EPYC processors offers substantial performance improvements, with an increase in power efficiency alongside the rise in power figures.

Cold plate cooling diagram featuring AMD SP7 with pump flow rate 1 LPM and PG25 coolant at OCP APAC Summit 2025.

Microloops has introduced an advanced cold plate specifically engineered for kW-level cooling due to the demanding thermal requirements of AMD’s SP7 socket. This new cooling solution features an inlet and outlet port, along with robust acrylic cover design and metal reinforcement. The mounting mechanism mirrors that of the previous SP5 configuration, utilizing six mounting screws to ensure stability.

Two Phase Cold Plate for kW-Level Cooling with AMD SP7 graphs showing R (°C/W) and ΔP (bar) versus Power (W) with fluorinated liquids.

Analysis from the manufacturer indicates that the power scaling for AMD’s EPYC SP7 series begins at 700W, extending up to a remarkable 1400W. This marks a notable increase, given that the current EPYC Turin processors typically peak at 500W. With SP7, the initial threshold already represents a substantial 40% rise.

Although EPYC Turin chips may exceed 500W under specific conditions and have seen Threadripper models surpass 1kW with Precision Boost Overdrive enabled, EPYC processors are not primarily designed for overclocking. Nonetheless, these developments hint at the considerable power potential that next-gen Threadrippers could achieve, possibly reaching between 1000W to 1500W when fully optimized.

Limitations of liquid cold plate performance chart with text: Performance ∝ 1 / (Rth * Ppump) and 100 µm fin / channel.
Electrochemical Additive Manufacturing (ECAM) process by Fabric8Labs with real-time print data and metal deposition.
Enhanced Thermal Performance with ECAM on Fabric8Labs technology presentation slide.
Advanced Cooling Channel Designs with triply periodic minimal surface, parametric 3D cooling, offset finlet structures by Fabric8Labs.

In a related discussion at the Hot Chips 2025 conference, FABRIC8LABS proposed a cutting-edge solution that surpasses traditional liquid-cooled cold plates. They highlighted the limitations associated with existing straight channel designs and introduced their Electrochemical Additive Manufacturing (ECAM) process, which can potentially enhance thermal performance by an impressive 20% to 85%.

Single Phase Liquid Cooling for AI Chips by Fabric8Labs showing 'Eliminates Hot Spots' and performance improvement details.
Performance Comparison vs. Straight Microchannels
Two Phase Liquid Cooling by Fabric8Labs shows capillary channel design and thermal resistance graph with power in watts.
Fabric8Labs boiler for AMD SP5 CPU with AEWIN performance results on display.
Silicon wafer coupon with ECAM printed copper structures by Fabric8Labs, labeled 'Potential for Wafer Scale Processing'.
ECAM Thermal Solution roadmap shows board-level cold plate evolving to direct-to-silicon integration by 2028 with Fabric8Labs branding.
Overview slide from Fabric8Labs featuring AI cooling hardware and text on thermal challenges and next-gen design.

Utilizing ECAM technology enables the design of innovative cooling channels for both CPUs and GPUs while lowering thermal resistance and opening possibilities for high TDP chips with reduced operating costs. The EPYC Venice processors, built on the Zen 6 architecture, will be the first to leverage the SP7 platform, with the introduction of an SP8 socket aimed at entry-level configurations as well.

These processors are set to launch in the near future, positioning themselves to compete robustly with Intel’s Clearwater Forest Xeon E-Core and Diamond Rapids Xeon P-Core product lines.

News Source: HXL (@9550pro)

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