New AI Chip for Apple Intelligence Servers in Collaboration with Broadcom

Apple is making significant strides into the generative AI sector, with plans to upgrade its AI intelligence servers. Currently powered by the M2 Ultra chip, these servers are expected to transition to the M4 Ultra if the company adheres to its projected release schedule. Interestingly, Apple is not venturing into this territory alone; new reports indicate a partnership with Broadcom to develop a novel chip.

Introducing ‘Baltra’: Apple’s AI Chip Expected in 2026

A recent report from AppleInsider, sourced from The Information, has revealed intriguing details about the forthcoming AI chip, codenamed ‘Baltra’. This chip is positioned to enhance Apple Intelligence servers by integrating more advanced cloud capabilities. Currently, Apple’s Large Language Models are being trained using Amazon’s specialized chips, indicating a rising demand for enhanced processing power to manage requests effectively.

‘Baltra’ is anticipated to utilize TSMC’s cutting-edge 3nm ‘N3P’ manufacturing process, which will also be employed for the production of the A19 and A19 Pro chips expected for the upcoming iPhone 17 lineup in 2024. The architecture of this new chip may include multiple specialized chiplets, each engineered for distinct functions. This design allows Apple to potentially integrate these chiplets into a cohesive unit, facilitated by Broadcom’s expertise in optimizing inter-chip communication within the Apple Intelligence servers.

Advantages of Chiplet Design in AI Development

The exploration of a chiplet architecture may serve several strategic purposes for Apple. Firstly, it simplifies manufacturing processes, which can mitigate production costs. Secondly, this arrangement grants Apple the ability to maintain a degree of confidentiality regarding its designs, even from partners like Broadcom. Additionally, earlier reports highlighted that Foxconn has been tasked with assembling these servers, with design assistance from Lenovo and its subsidiary, showcasing a collaborative approach in bringing this technology to fruition.

For more insights on this development, refer to the original article from The Information.

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