Micron’s Next-Gen HBM4 and HBM4E Production Timeline
Micron Technology has recently shared significant developments regarding its upcoming High Bandwidth Memory (HBM) processes, particularly HBM4 and HBM4E, indicating that mass production is projected to commence by 2026.
The Promise of HBM4 Technology
The HBM4 standard is poised to be a game changer within the memory market, touted as the “holy grail” of HBM technology. This innovative solution is designed to deliver exceptional performance and energy efficiency, effectively laying the groundwork for enhanced artificial intelligence (AI) computational capabilities.
Leveraging the strong foundation and continued investments in proven 1β process technology, we expect Micron’s HBM4 will maintain time to market and power efficiency leadership while boosting performance by over 50% over HBM3E. We expect HBM4 to ramp in high volume for the industry in calendar 2026.
Development work is well underway with multiple customers on HBM4E, which will follow HBM4. HBM4E will introduce a paradigm shift in the memory business by incorporating an option to customize the logic base die for certain customers using an advanced logic foundry manufacturing process from TSMC. We expect this customization capability to drive improved financial performance for Micron.
– Micron
Innovative Packaging Approaches
One of the standout features of HBM4 is the anticipated integration of memory and logic semiconductors within a single package. This innovation could eliminate the need for conventional packaging technologies, while the proximity of individual dies is expected to enhance performance efficiency significantly.
Specifications and Market Readiness
Exact specifications for Micron’s HBM4 technology are yet to be fully disclosed; however, initial reports suggest that it may include the capability to stack up to 16 DRAM dies, each offering a capacity of 32 GB, with a wide 2048-bit interface. This architecture marks a substantial advancement over its predecessors.
Adoption and Future Outlook
As for market adoption, HBM4 is anticipated to play a crucial role in NVIDIA’s Rubin AI architecture and AMD’s Instinct MI400 series. Given the surging demand for HBM technologies, Micron reports that its production capacity is set to reach optimal levels by 2025, signaling a promising future for both the company and the broader industry.
For more details on Micron’s developments in HBM technology, click here: Source & Images.
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