
MediaTek has officially announced the successful tape-out of its upcoming flagship System-on-Chip (SoC), which is set to utilize TSMC’s cutting-edge 2nm process. This innovative chip is anticipated to enter mass production by the close of 2026.
MediaTek Taps TSMC’s Pioneering 2nm Technology for Future-Ready SoC
In a recent announcement, MediaTek unveiled its plans for a next-generation flagship SoC, utilizing TSMC’s advanced 2nm process node. Expected to be ready for high-volume production by the end of 2026, this new chip reflects MediaTek’s ongoing commitment to innovation in semiconductor technology.
MediaTek revealed today (16) that it has successfully taped out its first flagship SoC leveraging TSMC’s 2nm process, marking a significant milestone as one of the early adopters of this technology. This collaboration signifies a step forward in combining high-performance and low-power consumption in applications spanning flagship mobile platforms, computing, automotive, and data centers. Both companies have worked diligently to achieve this breakthrough, enhancing their longstanding partnership.
TSMC’s 2nm process introduces a nanosheet transistor architecture, optimizing performance and energy efficiency while improving yield. MediaTek’s new SoC is projected to debut by late 2026.
In comparison to TSMC’s existing N3E process, the 2nm technology boasts a logic density increase of 1.2 times, delivers up to an 18% performance enhancement at the same power level, and reduces power usage by about 36% at equivalent speeds.
As MediaTek General Manager Guanzhou Chen stated, “The development of this chip using TSMC’s 2nm process technology showcases our leading-edge capability to incorporate advanced semiconductor processes across various solutions. Our strong collaboration with TSMC guarantees that our flagship products will offer outstanding performance and top-tier energy efficiency, providing exceptional solutions from edge to cloud for customers globally.”
While MediaTek has yet to specify the target market for this new flagship SoC, the implications suggest a potential partnership with NVIDIA, especially considering their previous collaboration on the GB10 “Grace Blackwell”Superchip. Earlier NVIDIA SoC series, including the N1 and N1X, have also been developed in collaboration with MediaTek, although formal announcements about their release remain pending, amid speculations of a launch in early 2025.

It seems that both MediaTek and NVIDIA may be strategically biding their time to ensure the optimal release of a robust SoC solution for the “AI PC”market. With TSMC’s state-of-the-art 2nm capabilities, this may be a prudent strategy to maximize the impact of their forthcoming launch.
In summary, the TSMC 2nm process offers impressive advancements, including a 20% increase in logic density, an 18% performance boost at equivalent power levels, and a significant 36% decrease in power consumption compared to the N3E process. Notably, the GB10 Superchip was crafted using TSMC’s 3nm technology, highlighting the advantages that the 2nm process will confer. Additionally, AMD is set to utilize this breakthrough technology for its Zen 6 CPUs.
Anticipation builds as more news regarding this flagship SoC is expected next year, likely during major tech events such as Computex 2026 or GTC 2026, either from MediaTek or in conjunction with NVIDIA. Stay tuned for updates as these developments unfold.
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